Eddy Roelants
Siemens
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Featured researches published by Eddy Roelants.
Circuit World | 1998
Mark D. Owen; Eddy Roelants; J. Van Puymbroeck
In the last two years, laser drilled microvias have become the dominant method for producing blind vias smaller than 150 mm, with over 100 laser drilling machines with a variety of laser types installed worldwide. Only a few of these systems have been qualified for drilling blind holes in standard glass reinforced FR4. Details a production line at Siemens AUT LP in Karlsruhe, Germany, involving the successful evaluation, introduction, and full production of laser drilling of FR4/glass. An ESI 5100 with Ultraviolet Nd:YAG laser operating at 355nm was chosen for all copper structuring and all microvias less than 150 mm in diameter in thin materials, and a TEA CO2 laser was chosen for thicker constructions, where at least 250 mm holes were required. Production has been running since November 1996. Details the process modifications, design rules, qualified materials, reliability tests, and production experiences.
Archive | 2002
Alexander Kilthau; Andre Kletti; Hans Mayer; Eddy Roelants
Archive | 2002
Hubert De Steur; Sébastian Edmé; Marcel Heerman; Eddy Roelants
Archive | 2000
Udo Wiggermann; Alex Schreiner; Hans Jürgen Mayer; Leo Higgins; Eddy Roelants
Archive | 1997
Eddy Roelants
Archive | 2002
Hubert De Steur; Hans Mayer; Otto Märten; Christian Overmann; Wei Pan; Eddy Roelants; Martin Wehner
Archive | 1990
Hans-Fr. Dr. Schmidt; Helmut Hadwiger; Milan Prochazka; Eddy Roelants
Archive | 2003
Hubert De Steur; Alexander Kilthau; Andre Kletti; Hans Mayer; Petra Mitzinneck; Eddy Roelants; Oliver Thuerk; Marc Van Biesen
Archive | 2001
Marcel Heerman; Eddy Roelants; Hubert De Steur
Archive | 2000
Leo Higgins; Hans Mayer; Eddy Roelants; Alex Schreiner; Udo Wiggermann