Edward Fuergut

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Composite board with semiconductor chips and plastic housing composition and method

Semiconductor device with a wiring substrate and method for producing the same

Reconfigured wafer alignment

Method for producing through-contacts and a semiconductor component with through-contacts

Semiconductor structure with a plastic housing and separable carrier plate

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Producing Thin Integrated Semiconductor Devices

Semiconductor Package and Methods of Formation Thereof

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material