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Edward Fürgut

Infineon Technologies

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Publication

Featured researches published by Edward Fürgut.

Archive | 2004

Electronic component and semiconductor wafer, and method for producing the same

Michael Bauer; Peter Strobel; Gerald Ofner; Edward Fürgut; Simon Jerebic; Thomas Bemmerl; Markus Fink; Hermann Vilsmeier

Archive | 2005

Encapsulation of semiconductor component with chip on substrate in mould tool of top and bottom half after fitting elastic cover over chip

Edward Fürgut; Holger Wörner

Archive | 2007

Semiconductor device including electronic component coupled to a backside of a chip

Edward Fürgut; Joachim Mahler; Michael Bauer

Archive | 2005

Semiconductor device for electronic device, has through contact arranged in prefabricated through contact flat rod, which is positioned in end region of device and exhibits through opening which is filled with metal

Michael Bauer; Markus Brunnbauer; Edward Fürgut; Ludwig Heitzer; Jens Pohl

Archive | 2005

Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts

Michael Bauer; Edward Fürgut; Simon Jerebic; Holger Wörner

Archive | 2003

Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben

Edward Fürgut; Hermann Vilsmeier; Holger Wörner

Archive | 2006

Mold for semiconductor packaging by injection-, compression- or transfer molding, includes capillary extensions in mold wall to form test pieces revealing air inclusions

Edward Fürgut; Hai Guan Loh

Archive | 2005

Semi-conductor component provided with through contacts which pass through plastic housing material and method for the production thereof

Michael Bauer; Thomas Bemmerl; Edward Fürgut; Simon Jerebic; Christian Stümpfl; Horst Theuss; Hermann Vilsmeier

Archive | 2005

Semiconductor device used in electronic apparatus, has adhesion promoter layer with microporous morphology between semiconductor device components and plastic compositions, and having nanoscale ceramic grains applied by wet chemical process

Michael Bauer; Thomas Bemmerl; Edward Fürgut

Archive | 2004

CHIP CARD, CHIP CARD MODULE AND METHOD FOR THE PRODUCTION OF A CHIP CARD MODULE

Holger Wörner; Edward Fürgut; Bernd Goller; Jens Pohl; Peter Strobel; Simon Jerebic; Robert-Christian Hagen

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Michael Bauer

Infineon Technologies

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Simon Jerebic

Infineon Technologies

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Markus Brunnbauer

Infineon Technologies

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Hermann Vilsmeier

Infineon Technologies

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Peter Strobel

Infineon Technologies

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Thomas Bemmerl

Infineon Technologies

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Jens Pohl

Siemens

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Gottfried Beer

Infineon Technologies

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Joachim Mahler

Infineon Technologies

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Irmgard Dr. Escher-Pöppel

Infineon Technologies

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