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Dive into the research topics where Edwin Paul Lopez is active.

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Featured researches published by Edwin Paul Lopez.


Archive | 2004

Solderability study of 63Sn-37Pb on zinc-plated and cadmium-plated stainless steel for the MC4636 lightning arrestor connector.

Edwin Paul Lopez; Paul T. Vianco; Jerome A. Rejent; Joseph J. Martin

Cadmium plating on metal surfaces is commonly used for corrosion protection and to achieve good solderability on the 304L stainless steel shell of the MC4636 lightning arrestor connector (LAC) for the W76-1 system. This study examined the use of zinc as a potential substitute for the cadmium protective surface finish. Tests were performed with an R and RMA flux and test temperatures of 230 C, 245 C, and 260 C. Contact angle, {theta}{sub c}, served as the generalized solderability metric. The wetting rate and wetting time parameters were also collected. The solderability ({theta}{sub c}) of the Erie Plating Cd/Ni coatings was better than that of similar Amphenol coatings. Although the {theta}{sub c} data indicated that both Cd/Ni platings would provide adequate solderability, the wetting rate and wetting time data showed the Amphenol coatings to have better performance. The Zn/Ni coatings exhibited non-wetting under all flux and temperature conditions. Based on the results of these tests, it has been demonstrated that zinc plating is not a viable alternate to cadmium plating for the LAC connectors.


Journal of Electronic Materials | 2005

Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substrates

Edwin Paul Lopez; Paul T. Vianco; Jerome A. Rejent


Journal of Electronic Materials | 2003

Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar

Edwin Paul Lopez; Paul T. Vianco; Jerome A. Rejent


Journal of Electronic Materials | 2010

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Edwin Paul Lopez; Paul T. Vianco; Jerome A. Rejent; Carly S. George; Alice C. Kilgo


American Welding Society | 2011

Solderability Testing Helps Select Surface Finishes.

Edwin Paul Lopez; Paul T. Vianco


Archive | 2010

The effect of silicone migration on foam adhesion.

Carly S. George; Edwin Paul Lopez; Edward Mark Russick; James Anthony Ohlhausen; Mark E. Stavig


Archive | 2010

Solderability testing of Pd-based electrical contact alloys.

Edwin Paul Lopez; Jerome A. Rejent; Donald Francis Susan


Archive | 2010

Solderability testing of electroless nickel-electroless palladium-immersion gold.

Carly S. George; Edwin Paul Lopez; Paul T. Vianco; William O. Wallace; Samuel J. Lucero


Archive | 2007

Effects of Storage Environments On The Solderability of Nickel-Palladium-Gold Finish With Pb-based And Pb-free Solders.

Edwin Paul Lopez; Paul T. Vianco; Samuel J. Lucero; Carly S. George


Archive | 2007

Comparison of the Solderability Performances of Inhibitor Containing and Inhibitor-Free Immersion Silver Coatings.

Edwin Paul Lopez; Paul T. Vianco; Samuel J. Lucero; R. Wayne Buttry

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Paul T. Vianco

Sandia National Laboratories

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Jerome A. Rejent

Sandia National Laboratories

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Carly S. George

Sandia National Laboratories

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Joseph J. Martin

Sandia National Laboratories

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Alice C. Kilgo

Sandia National Laboratories

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Donald Francis Susan

Sandia National Laboratories

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Edward Mark Russick

Sandia National Laboratories

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Mark E. Stavig

Sandia National Laboratories

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