Ellen Schwartz Tormey

31.2: Fabrication of 165 μm Pitched PDP Back Panel Based on LTCC‐M Technology

Orion Electric Co. has developed an XGA resolution, 165 μm pitch 25″ Plasma Display Back Panel by combining the process and cost benefits of the LTCC-M (Low Temperature Co-fired Ceramic on Metal) substrate technology with a high-resolution one-step “Barrier Embossing” technique. Tensile tests on green sheets were conducted and the effects of green sheet mechanical properties on embossed barrier height were investigated. LTCCM back panels (8″) were sealed to sodalime glass front panels and the assembled parts were successfully evacuated to 10−7 torr without cracks on the glass side.

An innovative semianalytical technique for ceramic evaluation at microwave frequencies

We have developed an innovative semianalytical technique for various substrate material characterization. The developed technique is a measurement procedure and data-reduction formulation that takes into consideration the radiation loss in a resonant structure, allowing for a more effective means of dielectric- and conductor-loss determination for a microstrip ring resonator and its substrate material. We separate dielectric and conductor loss precisely, evaluate the contribution of each term in the overall loss performance, and analytically predict the error in their respective predicted value.