Eric Ochs

MEMS MICROPHONE PACKAGE WITH MOLDED INTERCONNECT DEVICE

Microphone package and method for manufacturing same

Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing

MEMS CHIP SCALE PACKAGE

Electrical appliance with lubricated joint has at least one joint position with first joint partner, especially sleeve, and second joint partner, especially pin, whereby joint position has joint between two joint partners

Module, particularly sensor module, is provided with component and connecting element, where component is connected to another component in electrically conductive manner

SOLDER JOINT INSPECTION

Cavity package design

Microphone packaging and manufacturing method

Sensoranordnung zur Differenzdruckmessung