Frieder Haag

Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren

Method for packaging semiconductor chips and corresponding semiconductor chip system

Method for manufacturing a pressure sensor

Method for joining a silicon plate to a second plate

Electrical power supply to a tire pressure sensor is provided by voltage induced in coil when wheel rotates

Pressures sensor has moulded housing, pressure channel to semiconducting pressure transducer formed by interior vol. of cap formed by cap upper side, cap wall and opening

Lead frame device and method for producing the same

Semiconductor component and a method for identifying a semiconductor component

Method for producing a pressure sensor

Micromechanical component and corresponsing production method