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Featured researches published by Eric P. Dibble.


electronic components and technology conference | 1996

Transition: lessons learned in the development and production of IBM's /spl mu/Laminate/sup TM/ PBGA

Guy Delisle; Eric P. Dibble; James W. Fuller

This paper describes challenges encountered in the development of IBMs /spl mu/Laminate/sup TM/ PBGA. The implementation of a new product line was based on the factories in place to ramp production with extensions to base technology. Lessons learned in the product development are focused to provide an introspective look at organization and approaches. Solutions to the challenges cited are specific to the IBM product line and structure of the Endicott and Bromont facilities, but are also inherent to the PBGA product itself and should be applicable to other tools and designs. Specific areas discussed include the product development process vehicle decisions, the laminate development and ramp, bond and assembly development, and concludes with recommendations from the experience.


Archive | 1991

Applying solder to high density substrates

Eric P. Dibble; Steven L. Hanakovic; Voya R. Markovich; Daniel Scott Niedrich; Gary Paul Vlasak; Richard Stuart Zarr; Richard C. Senger


Archive | 1988

Connector for connecting flexible film circuit carrier to board or card

Eric P. Dibble; Alan D. Knight


Archive | 1997

Pin attach structure for an electronic package

Eric P. Dibble; Eric H. Laine; Stephen W. MacQuarrie


Archive | 1999

Method of improved cavity BGA circuit package

Eric P. Dibble; Eric A. Johnson; Raymond A. Phillips


Archive | 1986

Low contact electrical resistant composition, substrates coated therewith, and process for preparing such

J. J. Cuomo; Eric P. Dibble; Solomon Leon Levine


Archive | 1999

Process of producing plastic pin grid array

Eric P. Dibble; Eric H. Laine; Stephen W. MacQuarrie


Archive | 1988

Process for preparing low electrical contact resistance composition

J. J. Cuomo; Eric P. Dibble; Solomon Leon Levine


Archive | 1982

Masking for selective electroplating jet method

Eric P. Dibble; Thomas E. Lynch


Archive | 1987

Electrical resistant composition, substrates coated therewith, and process for preparing such

J. J. Cuomo; Eric P. Dibble; Solomon Leon Levine

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