Erich Syri

Integrated circuit with a housing accommodating the integrated circuit

Semiconductor assembly with a semiconductor module

Semiconductor component with semiconductor chip and rigid wiring board, which, on its underside, contains outer contacts and, on its top side, carries semiconductor chip

Heat sink for surface-mounted semiconductor devices and mounting method

Semiconductor component e.g. dynamic RAM, cooling device for computer system, has fan with air pressure outlet side connected to connector that directs cooling air from fan to components

Quad flat non-leaded package semiconductor component, has expansion joint arranged in plastic housing and provided between border angle region and outer contact surfaces of outer contact and central region of housing

Cooling system for devices comprising power semi-conductors and method for cooling said type of device

Semiconductor component with surface mountable devices and method for producing the same

Halbleiter-Bauelement, Halbleitermodul und Verfahren zum Montieren des Halbleiter-Bauelements und zum Handhaben des Halbleitermoduls Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module