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Erich Syri

Infineon Technologies

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Publication

Featured researches published by Erich Syri.

Archive | 1999

Integrated circuit with a housing accommodating the integrated circuit

Erich Syri; Bernd Römer

Archive | 2003

Semiconductor assembly with a semiconductor module

Jürgen Högerl; Erich Syri

Archive | 2003

Semiconductor component with semiconductor chip and rigid wiring board, which, on its underside, contains outer contacts and, on its top side, carries semiconductor chip

Juergen Hoegerl; Gerold Gruendler; Volker Strutz; Erich Syri

Archive | 2006

Heat sink for surface-mounted semiconductor devices and mounting method

Gerold Gruendler; Juergen Hoegerl; Thomas Killer; Volker Strutz; Erich Syri

Archive | 2004

Semiconductor component e.g. dynamic RAM, cooling device for computer system, has fan with air pressure outlet side connected to connector that directs cooling air from fan to components

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Erich Syri

Archive | 2006

Quad flat non-leaded package semiconductor component, has expansion joint arranged in plastic housing and provided between border angle region and outer contact surfaces of outer contact and central region of housing

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Thomas Killer; Volker Strutz; Erich Syri

Archive | 2005

Cooling system for devices comprising power semi-conductors and method for cooling said type of device

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Erich Syri

Archive | 2010

Semiconductor component with surface mountable devices and method for producing the same

Erich Syri; Gerold Gruendler; Juergen Hoegerl; Thomas Killer; Volker Strutz

Archive | 2009

Halbleiter-Bauelement, Halbleitermodul und Verfahren zum Montieren des Halbleiter-Bauelements und zum Handhaben des Halbleitermoduls Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Thomas Killer; Erich Syri; Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Hermann Josef Lutz

Archive | 2009

Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Thomas Killer; Erich Syri; Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Hermann Josef Lutz

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Volker Strutz

Infineon Technologies

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Jürgen Högerl

Infineon Technologies

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Gerold Dipl.-Phys. Gründler

Infineon Technologies

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Thomas Killer

Infineon Technologies

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Juergen Hoegerl

Infineon Technologies

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Gerold Gruendler

Infineon Technologies

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Bernd Römer

Infineon Technologies

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