Juergen Hoegerl

Cooling System For Device Having Power Semiconductors And Method For Cooling The Device

Semiconductor Device for an Ultra Wideband Standard for Ultra-High-Frequency Communication, and Method for Producing the Same

SMART CARD MODULE, SMART CARD AND METHOD FOR PRODUCING A SMART CARD MODULE

Method and device for packaging and transporting electronic components

Chip card module with separate antenna and chip card inlay using same

Electronic component comprises a semiconductor chip having an active upper side with integrated circuits and a passive rear side without integrated circuits

Semiconductor component with semiconductor chip and rigid wiring board, which, on its underside, contains outer contacts and, on its top side, carries semiconductor chip

Semiconductor module and a method for fabrication thereof by extended embedding technologies

Microphone Module and Method of Manufacturing Thereof

Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same