Gerold Dipl.-Phys. Gründler

Semiconductor component e.g. dynamic RAM, cooling device for computer system, has fan with air pressure outlet side connected to connector that directs cooling air from fan to components

Quad flat non-leaded package semiconductor component, has expansion joint arranged in plastic housing and provided between border angle region and outer contact surfaces of outer contact and central region of housing

Electronic component with external flat conductors and a method for producing the electronic component

Cooling system for devices comprising power semi-conductors and method for cooling said type of device

Halbleiter-Bauelement, Halbleitermodul und Verfahren zum Montieren des Halbleiter-Bauelements und zum Handhaben des Halbleitermoduls Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Ball grid array type semiconductor component, has cooling unit from made of e.g. copper and including two sections, where one section is partially arranged between chip and substrate, and other section partially runs on housing surface

Semiconductor module comprising semiconductor chips that are contained in separate areas of a plastic housing and method for producing said module

Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung

Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation