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Gerold Dipl.-Phys. Gründler

Infineon Technologies

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Publication

Featured researches published by Gerold Dipl.-Phys. Gründler.

Archive | 2004

Semiconductor component e.g. dynamic RAM, cooling device for computer system, has fan with air pressure outlet side connected to connector that directs cooling air from fan to components

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Erich Syri

Archive | 2006

Quad flat non-leaded package semiconductor component, has expansion joint arranged in plastic housing and provided between border angle region and outer contact surfaces of outer contact and central region of housing

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Thomas Killer; Volker Strutz; Erich Syri

Archive | 2003

Electronic component with external flat conductors and a method for producing the electronic component

Gerold Dipl.-Phys. Gründler

Archive | 2005

Cooling system for devices comprising power semi-conductors and method for cooling said type of device

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Erich Syri

Archive | 2009

Halbleiter-Bauelement, Halbleitermodul und Verfahren zum Montieren des Halbleiter-Bauelements und zum Handhaben des Halbleitermoduls Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Thomas Killer; Erich Syri; Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Hermann Josef Lutz

Archive | 2009

Semiconductor device, semiconductor module, and method of assembling the semiconductor device and handling of the semiconductor module

Thomas Killer; Erich Syri; Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Volker Strutz; Hermann Josef Lutz

Archive | 2006

Ball grid array type semiconductor component, has cooling unit from made of e.g. copper and including two sections, where one section is partially arranged between chip and substrate, and other section partially runs on housing surface

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Thomas Killer; Volker Strutz; Erich Syri

Archive | 2006

Semiconductor module comprising semiconductor chips that are contained in separate areas of a plastic housing and method for producing said module

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Thomas Killer; Volker Strutz; Erich Syri

Archive | 2006

Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Thomas Killer; Volker Strutz; Erich Syri

Archive | 2006

Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation

Gerold Dipl.-Phys. Gründler; Jürgen Högerl; Thomas Killer; Volker Strutz; Erich Syri

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Collaboration

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Erich Syri

Infineon Technologies

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Jürgen Högerl

Infineon Technologies

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Volker Strutz

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Thomas Killer

Infineon Technologies

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Alexandra Atzesdorfer

Infineon Technologies

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Heinz Pape

Infineon Technologies

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Michael Bauer

Infineon Technologies

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Peter Strobel

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Rudolf Kerler

Infineon Technologies

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Wolfram Eurskens

Infineon Technologies

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