Shinji Ohuchi

Resin sealing type semiconductor device

Using grooves as alignment marks when dicing an encapsulated semiconductor wafer

Semiconductor device, manufacturing method thereof and aggregate type semiconductor device

Semiconductor device having first and second sealing resins

Bond pad for stress releif between a substrate and an external substrate

Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby

Method of manufacturing semiconductor device including semiconductor elements mounted on base plate

Manufacturing method of stack-type semiconductor device

Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device

Semiconductor device, manufacturing method for semiconductor device and mounting method for the same