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Featured researches published by Eung-Suek Lee.


Nanotechnology | 2008

Silver-plated carbon nanotubes for silver/conducting polymer composites

Youngseok Oh; Daewoo Suh; Young-Jin Kim; Eung-Suek Lee; Jee Soo Mok; Jae-Boong Choi; Seunghyun Baik

Carbon nanotubes (CNTs) have advantages as conductive fillers due to their large aspect ratio and excellent conductivity. In this study, a novel silver/conducting polymer composite was developed by the incorporation of silver-plated CNTs. It is important to achieve a homogeneous dispersion of nanotubes and to improve the interfacial bonding to utilize the excellent properties of reinforcements in the matrix material. The homogeneous dispersion of nanotubes was achieved by an acid treatment process, and the interfacial contact was improved by electroless silver plating around nanotubes. The resistivity of the silver/conducting polymer composite was decreased by 83% by the addition of silver-plated single-walled carbon nanotubes. Conductive bumps were also screen-printed to demonstrate the capability of the composite as electrical interconnects for multi-layer printed circuit boards.


Journal of Materials Chemistry | 2010

Functionalized nano-silver particles assembled on one-dimensional nanotube scaffolds for ultra-highly conductive silver/polymer composites

Youngseok Oh; Kyoung-Yong Chun; Eung-Suek Lee; Young-Jin Kim; Seunghyun Baik

A novel silver/polymer composite with electrical conductivity (2.5 × 105 S cm−1) higher than that of bulk tungsten was developed through the addition of a small amount of multi-walled carbon nanotubes decorated with glutaric acid functionalized nano-silver particles (1.5 wt%). The nanotubes were used as one-dimensional conductive scaffolds constructing an effective electrical network among micron-sized silver powders.


Spie Newsroom | 2010

Environment-favorable applications for carbon nanotubes

Seunghyun Baik; Youngseok Oh; Kyoung-Yong Chun; Young-Jin Kim; Cheesung Lee; Eung-Suek Lee

Polymer-based conductive pastes have been actively investigated as possible replacements for lead-based solders in electronic circuits. However, potential for increasing the electrical conductivity of polymer composites reinforced by metallic fillers is limited because of the generally poor contacts.1, 2 Although metallic fillers generate electrical paths in the polymer matrix, poor contacts prevent the electrical conductivity of metal/polymer composites from reaching the levels usually achieved for bulk metals.2 Therefore, the efficiency of the electrical network (a key parameter for increasing its conductivity) is largely dependent on network morphology and junction quality. We have significantly improved the electrical conductivity of silver (Ag)/polymer composites by incorporating multiwalled carbon nanotubes (MWNTs) decorated with self-assembled nano-Ag particles with an average size of 5nm.2 We functionalized the nano-Ag particles with phenyl rings—see Figure 1(a)— which can lead to homogeneous dispersion and attachment to MWNTs through the – interaction (‘stacking’) without detrimental effects on the MWNTs’ electrical and mechanical properties.3–6 We additionally functionalized the nano-Ag particles on MWNTs with glutaric acid (g-Ag-MWNTs) to prevent oxidation.2 Figure 1(b) shows that MWNTs coated with such particles form an effective electrical network based on micrometer-sized silver powders. We employed the tubes as 1D scaffolds and improved the contact interface by attaching nano-Ag particles. The conductivity achieved for the composite (2:5 105S/cm) was even higher than that of bulk tungsten (1:9 105S/cm), and we successfully screen printed electrical interconnects: see Figure 1(c).2 This novel composite might find Figure 1. (a) Electrical-network formation by glutaric-acidfunctionalized nano-silver particles attached to multiwalled carbon nanotubes (g-Ag-MWNTs).2 (b) Transmission-electron-microscope image of solid contacts between micrometer-sized silver powders and g-Ag-MWNTs after annealing at 185C for 1h. (c) Screen-printed electrical interconnects.


Archive | 2008

CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME

Eung-Suek Lee; Seung-Hyun Baik; Young-Jin Kim; Young-Seok Oh; Jae-Boong Choi; Dae-Woo Suh; Je-Gwang Yoo; Chang-Sup Ryu; Jun-Oh Hwang; Jee-Soo Mok


Archive | 2008

Conductive paste including a carbon nanotube and printed circuit board using the same

Eung-Suek Lee; Je-Gwang Yoo; Chang-Sup Ryu; Jun-Oh Hwang; Tae-Eun Chang; Jee-Soo Mok


Archive | 2008

Printed circuit board using paste bump and manufacturing method thereof

Jee-Soo Mok; Chang-Sup Ryu; Eung-Suek Lee; Youn-Soo Seo; Hee-Bum Shin; Yoong Oh; Byung-Bae Seo; Tae Kyoung Kim; Dong-jin Park


Archive | 2007

Printed circuit board and method for manufacturing thereof

Eung-Suek Lee; Keun-Ho Kim


Archive | 2010

Method of manufacturing a circuit board

Keun-Ho Kim; Jong-Guk Kim; II-Kyoon Jeon; Eung-Suek Lee


Archive | 2008

Method of interconnecting layers of a printed circuit board

Eung-Suek Lee; Young-Jin Kim; Seung-Hyun Baik; Jae-Boong Cho; Young-Seok Oh; Dae-Woo Suh; Je-Gwang Yoo; Jee-Soo Mok; Chang-Sup Ryu


Archive | 2009

Printed circuit board having fine pattern and manufacturing method thereof

Jee-Soo Mok; Chang-Sup Ryu; Eung-Suek Lee; Ki-Hwan Kim; Sung-Yong Kim

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Chang-Sup Ryu

Samsung Electro-Mechanics

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Jee-Soo Mok

Samsung Electro-Mechanics

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Je-Gwang Yoo

Samsung Electro-Mechanics

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Jae-Boong Choi

Samsung Electro-Mechanics

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Jun-Oh Hwang

Samsung Electro-Mechanics

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Ki-Hwan Kim

Samsung Electro-Mechanics

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Seung-Hyun Baik

Samsung Electro-Mechanics

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Young-Seok Oh

Samsung Electro-Mechanics

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