Fengnan Li

Fabrication of UV Photodetector on TiO2/Diamond Film.

The properties of ultraviolet (UV) photodetector fabricated on TiO2/diamond film were investigated. Single crystal diamond layer was grown on high-pressure-high-temperature Ib-type diamond substrate by microwave plasma chemical vapor deposition method, upon which TiO2 film was prepared directly using radio frequency magnetron sputtering technique in Ar and O2 mixing atmosphere. Tungsten was used as electrode material to fabricate metal-semiconductor-metal UV photodetector. The dark current is measured to be 1.12u2009pA at 30u2009V. The photo response of the device displays an obvious selectivity between UV and visible light, and the UV-to-visible rejection ratio can reach 2 orders of magnitude. Compared with that directly on diamond film, photodetector on TiO2/diamond film shows higher responsivity.

Fabrication of three dimensional diamond ultraviolet photodetector through down-top method

Three dimensional diamond ultraviolet (UV) photodetector have been fabricated on diamond epitaxial layer through down-top approach, where diamond epitaxial layer was grown between metal electrodes. A thin diamond epitaxial layer was first grown on high-pressure high-temperature single crystal diamond substrate. Then, the diamond epitaxial layer was covered by interdigitated tungsten electrodes. Furthermore, another diamond epitaxial layer was grown on uncovered area. At last, UV-Ozone treatment was used to oxidize the surface. The optoelectronic performance of the photodetector was characterized, exhibiting a large responsivity and a repeatable transient response behavior. Moreover, down-top process is beneficial for the electrode conductivity stability. Also, an ohmic contact could be formed between tungsten and diamond during growth. The results indicate that down-top process is an efficient way for fabrication of three dimensional diamond photodetectors.

Fabrication of monolithic diamond photodetector with microlenses

A monolithic diamond photodetector with microlenses is fabricated by etching microlens arrays (MLAs) on single crystal diamond surface and patterning tungsten electrode strips on the edge of these arrays. Firstly, compact MLAs are etched on half of diamond sample surface by thermal reflow method. Secondly, via magnetron sputtering technique, two sets of interdigitated tungsten electrodes are patterned on the sample surface, one set is on the edge of MLAs, the other set is on the planar area. The optoelectronic performances of photodetectors have been investigated and indicated that the photocurrent of microlens photodetector increases by 74.8 percent at 10 V under 220 nm UV light illumination by comparing with that in planar case. Simulations of photodetectors electrical and optical properties have been carried out, illustrating an improvement of charge collection ability and light absorption efficiency in microlens case. Furthermore, the present device structure can be extended to other semiconductor photodetectors.

Ohmic contact between iridium film and hydrogen-terminated single crystal diamond

Investigation of ohmic contact between iridium (Ir) film and hydrogen-terminated single crystal diamond has been carried out with annealing temperature from 300 to 600u2009°C in argon (Ar) and hydrogen ambient. Electrodes were deposited on hydrogen-terminated single crystal diamond by electron beam evaporation technique, and specific contact resistivity has been measured by transmission line model. The interface between Ir film and hydrogen-terminated single crystal diamond was characterized by transmission electron microscopy and energy dispersive X-ray spectroscopy. Theoretical calculation value of barrier height between Ir film and hydrogen-terminated single crystal diamond was around −1.1u2009eV. All results indicate that an excellent ohmic contact could be formed between Ir film and hydrogen-terminated single diamond.