Frank L. Hall

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material

Underfilled, encapsulated semiconductor die assemblies and methods of fabrication

Methods of fabricating underfilled, encapsulated semiconductor die assemblies

Methods for molding a semiconductor die package with enhanced thermal conductivity

Apparatus and method for molding a semiconductor die package with enhanced thermal conductivity

Underfilled semiconductor die assemblies and methods of forming the same

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Methods of manufacturing microelectronic imaging units with discrete standoffs

Procédé permettant de former des structures d'écartement moulées sur des dispositifs à circuits intégrés