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Todd O. Bolken

Micron Technology

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Publication

Featured researches published by Todd O. Bolken.

Archive | 2001

Semiconductor card and method of fabrication

David J. Corisis; Todd O. Bolken

Archive | 2003

Packages for semiconductor die

Todd O. Bolken; Cary J. Baerlocher; David J. Corisis; Chad A. Cobbley

Archive | 1999

Controlling packaging encapsulant leakage

Patrick W. Tandy; Joseph M. Brand; Brad D. Rumsey; Steven R. Stephenson; David J. Corisis; Todd O. Bolken; Edward A. Schrock; Brenton L. Dickey

Archive | 2005

Moisture-resistant electronic device package and methods of assembly

Todd O. Bolken; Cary J. Baerlocher; Steven W. Heppler; Chad A. Cobbley

Archive | 1999

Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities

Todd O. Bolken; David L. Peters; Patrick W. Tandy; Chad A. Cobbley

Archive | 2004

Techniques for packaging multiple device components

Todd O. Bolken; Chad A. Cobbley

Archive | 2002

TWO-STAGE TRANSFER MOLDING METHOD TO ENCAPSULATE MMC MODULE

Todd O. Bolken

Archive | 2003

Semiconductor component having stacked, encapsulated dice

Todd O. Bolken; Chad A. Cobbley

Archive | 2003

Image sensor packages

Todd O. Bolken; Chad A. Cobbley

Archive | 2003

Method for fabricating semiconductor component having stacked, encapsulated dice

Todd O. Bolken; Chad A. Cobbley

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Chad A. Cobbley

Micron Technology

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Cary J. Baerlocher

Micron Technology

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David J. Corisis

Micron Technology

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Mark S. Johnson

Micron Technology

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David L. Peters

Micron Technology

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Chan Yoo

Micron Technology

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Brad D. Rumsey

Micron Technology

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Frank L. Hall

Micron Technology

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Patrick W. Tandy

Micron Technology

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Bret K. Street

Micron Technology

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