James M. Derderian

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer

Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods

Thinned, strengthened semiconductor substrates and packages including same

Process for strengthening semiconductor substrates following thinning

Substrate thinning including planarization

Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another

Die package having an adhesive flow restriction area

Flip-chip image sensor packages and methods of fabricating the same

Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween