Frank S. d'Aragona

Gradient chuck method for wafer bonding employing a convex pressure

Automated method for joining wafers

Monocrystalline semiconductor buried layers for electrical contacts to semiconductor devices

Vertical current flow semiconductor device utilizing wafer bonding

Method of making dielectric and conductive isolated island

Silicon film with improved thickness control

Method of bonding a semiconductor wafer

Method of making a void free wafer via vacuum lamination

Low voltage, deep junction device and method

Conductive diffusion barrier of titanium nitride in ohmic contact with a plurality of doped layers therefor