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Dive into the research topics where Fred Haring is active.

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Featured researches published by Fred Haring.


electro/information technology | 2014

An investigation of the viability of UHF RFID for subsurface soil sensors

Cherish Bauer-Reich; K. C. Tan; Fred Haring; Nathan Schneck; A. Wick; Layne A. Berge; Justin Hoey; Robert A. Sailer; Chad A. Ulven

A study was performed to assess the viability of using ultra-high frequency (UHF) radio frequency identification (RFID) to communicate with subsurface sensors. The results showed that, when the reader operated near the FCC limit, read ranges for the sensorwere greater than a half meter for soil moisture levels of 15% by weight or less. Moisture levels at 15% or greater resulted in significant attenuation or complete loss of signal. Tags also had desireable read ranges for depths up to 15 cm.


International Symposium on Microelectronics | 2010

Laser Patterning and Via Drilling of Sapphire Wafers and Die

Justin Vignes; Fred Haring; Syed Sajid Ahmad; Kaycie Gerstner; Aaron Reinholz


International Symposium on Microelectronics | 2010

Fine Feature Solder Paste Printing For Solder Sphere and Solder Trace Manufacturing

Nicole Dallman; Kaycie Gerstner; Kristi Jean; Fred Haring; Syed Sajid Ahmad; Aaron Reinholz


ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability | 2009

Electroless Nickel Plating Process Optimization for Aluminum Terminals

Philip Westby; Kevin Mattson; Fred Haring; Jacob Baer; Matt Steele; Syed Sajid Ahmad; Aaron Reinholz


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2015

Problems and promises of sapphire micromachining

Syed Sajid Ahmad; Fred Haring


International Symposium on Microelectronics | 2014

Package-on-Package Design and Assembly Process Development for Size Reduction

Syed Sajid Ahmad; Mike Reich; Fred Haring; Layne A. Berge; Kevin Mattson; Cherish Bauer-Reich; Bob Gilbertson; Greg Strommen


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2014

Development of Passives on Sapphire Backside

Syed Sajid Ahmad; Cherish Bauer-Reich; Fred Haring; Greg Strommen; Kevin Mattson; Aaron Reinholz


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2014

Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip

Syed Sajid Ahmad; Fred Haring; Aaron Reinholz; Nathan Schneck


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2014

Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking

Syed Sajid Ahmad; Fred Haring; Greg Strommen; Kevin Mattson; Aaron Reinholz


International Symposium on Microelectronics | 2010

Characterization of Substrate Materials For End-Use Environment Classification

Syed Sajid Ahmad; Arun Shankaran; Fred Haring; Justin Vignes; Bernd Scholz; Aaron Reinholz

Collaboration


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Syed Sajid Ahmad

North Dakota State University

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Aaron Reinholz

North Dakota State University

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Kevin Mattson

North Dakota State University

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Cherish Bauer-Reich

North Dakota State University

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Greg Strommen

North Dakota State University

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Layne A. Berge

North Dakota State University

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Nathan Schneck

North Dakota State University

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A. Wick

North Dakota State University

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Bernd Scholz

North Dakota State University

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Chad A. Ulven

North Dakota State University

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