Syed Sajid Ahmad

Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes

Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

Die positioning in integrated circuit packaging

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Method of attaching a leadframe to singulated semiconductor dice

Lead frame surface finish enhancement

Stereolithographic method and apparatus for fabricating stabilizers for flip-chip type semiconductor devices and resulting structures

Sloped vias in a substrate, spring-like deflecting contacts, and methods of making

Test carrier with molded interconnect for testing semiconductor components

Programmable material consolidation systems and methods