G. Doornbos

Germanium p-Channel FinFET Fabricated by Aspect Ratio Trapping

We report scaled Ge p-channel FinFETs fabricated on a 300-mm Si wafer using the aspect-ratio-trapping technique. For long-channel devices, a combination of a trap-assisted tunneling and a band-to-band tunneling leakage mechanism is responsible for an elevated bulk current limiting the OFF-state drain current. However, the latter can be mitigated by device design. We report low long-channel subthreshold swing of 76 mV/decade at VDS=-0.5 V, good short-channel effect control, and high transconductance (gm=1.2 mS/μm at VDS=-1 V and 1.05 mS/μm at VDS=-0.5 V for LG=70 nm). The Ge FinFET presented in this paper exhibits the highest gm/SSsat at VDD=1 V reported for nonplanar unstrained Ge p-FETs to date.

Benchmarking of III–V n-MOSFET Maturity and Feasibility for Future CMOS

With the consideration of III-V channels for future CMOS, an urgent need for standard metrics to assess the maturity of III-V MOSFETs and to investigate their suitability for future CMOS has arisen. By proposing such standard metrics (Q ≡gm/S), we find that present InGaAs n-MOSFETs are trailing Si MOSFETs by over a factor of 30. Still, experimental PHEMT data make a clear case for the utilization of InAs channels in future CMOS from a performance standpoint both for HP (1.4-1.7 times the current drive increase over Si) and LOP (1.7-3 times) applications.

Demonstration of scaled Ge p-channel FinFETs integrated on Si

We report the first demonstration of scaled Ge p-channel FinFET devices fabricated on a Si bulk FinFET baseline using the Aspect-Ratio-Trapping (ART) technique [1]. Excellent subthreshold characteristics (long-channel subthreshold swing SS=76mV/dec at 0.5V), good SCE control and high transconductance (1.2 mS/μm at 1V, 1.05 mS/μm at 0.5V) are achieved. The Ge FinFET presented in this work exhibits highest gm/SS at Vdd=1V reported for non-planar unstrained Ge pFETs to date.

Investigation of Strain Engineering in FinFETs Comprising Experimental Analysis and Numerical Simulations

This study combines direct measurements of strain, electrical mobility measurements, and a rigorous modeling approach to provide insights about strain-induced mobility enhancement in FinFETs and guidelines for device optimization. Good agreement between simulated and measured mobility is obtained using strain components measured directly at device level by a novel holographic technique. A large vertical compressive strain is observed in metal gate FinFETs, and the simulations show that this helps recover the electron mobility disadvantage of the (110) FinFET lateral interfaces with respect to (100) interfaces, with no degradation of the hole mobility. The model is then used to systematically explore the impact of stress components in the fin width, height, and length directions on the mobility of both n- and p-type FinFETs and to identify optimal stress configurations. Finally, self-consistent Monte Carlo simulations are used to investigate how the most favorable stress configurations can improve the on current of nanoscale MOSFETs.

An Ultralow-Resistance Ultrashallow Metallic Source/Drain Contact Scheme for III–V NMOS

We report an ultrashallow metallic source/drain (S/D) contact scheme for fully self-aligned III-V NMOS with specific contact resistivity and sheet resistance which, for the first time, demonstrate performance metrics that may be compatible with the ITRS R_ext requirements for 12-nm technology generation device pitch. The record specific contact resistivity between the contact pad and metallic S/D of ρ_c = 2.7 ·10^-9 Ω·cm² has been demonstrated for 10 nm undoped InAs channels by forming an ultrashallow crystalline ternary NiInAs phase with R_sh = 97 Ω/sq for a junction depth of 7 nm. The junction depth of the S/D scheme is highly controllable and atomically abrupt.

Scaled p-channel Ge FinFET with optimized gate stack and record performance integrated on 300mm Si wafers

We demonstrate scaled, replacement gate high-k/metal gate p-channel Ge FinFETs integrated onto 300mm Si wafers for which the best device shows record peak g_{m, ext}=2.7mS/μm (g_{m, int}=3.3mS/μm), Q (≡g_{m, ext}/SS_sat) = 32.4 and I_on= 497μA/μm at I_off = 100nA/μm, all at V_ds= -0.5V. The high performance is a result of successful integration of <;110> oriented, highly scaled Ge fins on silicon substrates and of a low D_it gate stack with capacitance equivalent thickness=8Å. This optimized gate stack supports the highest hole mobility ever reported at sub-10Å CET. Furthermore, Ge FinFETs in the present work outperform any other reported Ge devices by more than ~2.5× (g_m/SS metric) and ~2× (I_on/I_off metric) at shortest gate lengths (down to 20nm) to the best of our knowledge.

First observation of FinFET specific mismatch behavior and optimization guidelines for SRAM scaling

Vt-mismatch, and thus SRAM scalability, is greatly improved in narrow SOI FinFETs, with respect to planar bulk, because of their undoped channel and near-ideal gate control. We show by simulations and by measurements that in FinFETs, unlike planar bulk, beta-mismatch becomes dominant, leading to radically different SRAM characteristics. By careful process tuning, we demonstrate a substantial reduction in beta-mismatch. We show the impact of this novel mismatch behavior on SRAM performance and yield under various optimization strategies and thereby provide guidelines for SRAM design in a FinFET technology.

InAs hole inversion and bandgap interface state density of 2 x 10(11) cm(-2) eV(-1) at HfO2/InAs interfaces

High-k/InAs interfaces have been manufactured using InAs surface oxygen termination and low temperature atomic layer deposition of HfO2. Capacitance–voltage (C–V) curves revert to essentially classical shape revealing mobile carrier response in accumulation and depletion, hole inversion is observed, and predicted minority carrier response frequency in the hundred kHz range is experimentally confirmed; reference samples using conventional techniques show a trap dominated capacitance response. C–V curves have been fitted using advanced models including nonparabolicity and Fermi-Dirac distribution. For an equivalent oxide thickness of 1.3 nm, an interface state density Dit = 2.2 × 1011 cm−2 eV−1 has been obtained throughout the InAs bandgap.

Experimental and physics-based modeling assessment of strain induced mobility enhancement in FinFETs

This study combines direct measurements of channel strain, electrical mobility measurements and a rigorous modeling approach to provide insight about the strain induced mobility enhancement in FinFETs and guidelines for the device optimization. Good agreement between simulated and measured mobility is obtained using strain components measured directly at device level by a novel technique. A large vertical compressive strain is observed in FinFETs and the simulations show that this helps recover the electron mobility disadvantage of the (110) FinFETs lateral interfaces w.r.t. (100) interfaces, with no degradation of the hole mobility. The model is then used to systematically explore the impact of the fin-width, fin-height and fin-length stress components on n- and p-FinFETs mobility and to identify optimal stress configurations.

Gatestacks for scalable high-performance FinFETs

Excellent performance (995 muA/mum at Ioff=94 n A/mum and Vdd=lV) and short channel effect control are achieved for tall, narrow FinFETs without mobility enhancement. Near-ideal fin/gate profiles are achieved with standard 193 nm immersion lithography and dry etch. PVD TiN electrodes on Hf SiO dielectrics are shown to give improved NMOS performance over PEALD TiN whilst poorer conformality, for both dielectric and gate electrode, does not appear to impact scalability or performance. Excellent PMOS performance is achieved for both PEALD and PVD TiN. A new model for threshold voltage VT variability is shown to explain this dependence upon fin width and gate length.