Gareth G. Hougham

Is 25 Gb/s On-Board Signaling Viable?

What package improvements are required for dense, high-aggregate bandwidth buses running at data rates beyond 10 Gb/s per channel, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Hardware-validated models of advanced organic modules and printed circuit boards were used to explore these limits. Simulations of link performance performed with an internal link modeling tool allowed us to explore the effect of equalization and modulation formats at different data rates on link bit error rate and eye opening. Our link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signaling limits were then determined by extrapolating these hardware-correlated models to higher speeds, and these limits were compared to the results of recent work on on-board optical interconnects.

56.3: Development of One Drop Fill Technology for AM‐LCDs

A new cell process for TFT-LCDs which integrates the liquid crystal (LC) injection with the glass substrate assembly process has been developed and has similarities to that previously reported for passive LCDs. In this process LC is applied in droplets directly onto the glass substrate, and results in reduced LC waste, reduction of fabrication time, and overall process simplification. With this technology, we fabricated 22 inch diagonal, high-resolution products and achieved better cell gap uniformity and fast (16.7 ms) time response for the in-plane switching (IPS) mode LCDs.

56.1: Novel LC Alignment Method using Diamond Like Carbon Film and Ion Beam Alignment

A novel LC alignment method has been developed. In this, the conventional polyimide film and cloth rubbing have been replaced by a diamond-like-carbon film and an ion beam respectively. The novel method has been used in pilot-line manufacturing to produce super high quality panels: 15″ TN mode and 22″ IPS mode. These panels will be demonstrated, and the advantage of new method will be discussed.

Reaction of polyaniline with NMP at elevated temperatures

Heating a dilute solution of polyaniline emeraldine base in 1-methyl-2 pyrrolidinone under nitrogen at elevated temperatures resulted in the reduction of PANI to its leucoemeraldine state. The product was identified by infra-red, ultraviolet-visible, and X-ray photoelectron spectroscopy, and characterized by cyclic voltammetry and gel permeation chromatography.