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Goller Bernd

Infineon Technologies

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Publication

Featured researches published by Goller Bernd.

Archive | 2003

Elektronisches Bauteil und Verfahren zu seiner Herstellung

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2003

Electronic component, used in flip-chip technology, comprises semiconductor chip block with contact surfaces with contact humps on its active chip surface and intermediate support formed as wiring plate with wiring surfaces

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger; Heindl Werner

Archive | 2004

Messgerät für einen Biosensor in Chipkartenform und Messverfahren

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Bauer Michael; Woerner Holger

Archive | 2005

Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls

Woerner Holger; Fuergut Edward; Goller Bernd; Pohl Jens; Strobel Peter; Jerebic Simon; Hagen Robert-Christian

Archive | 2003

Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2002

Electronic component used as logical unit comprises first semiconductor chip and second semiconductor chip each having contact surfaces on their active surfaces, substrate with contact connection surfaces and external contact surfaces

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2005

Sensorbauteil und nutzen zu seiner herstellung

Fuergut Edward; Goller Bernd; Hagen Robert-Christian; Jerebic Simon; Pohl Jens; Strobel Peter; Woerner Holger

Archive | 2003

Electronic component comprises a semiconductor element mounted in a plastic housing, and electrical connections arranged between contact surfaces on an active surface of the element and contact connecting surfaces of conductor connections

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger; Heindl Werner

Archive | 2001

Electronic component has semiconductor chips whose passive back sides are fastened to top side of carrier substrate and active chip surface, respectively

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2018

VERFAHREN ZUM PRODUZIEREN EINES HALBLEITERMODULS

Wächter Claus Von; Maier Dominic; Goller Bernd; Ledutke Michael; Fürgut Edward

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Hagen Robert-Christian

Infineon Technologies

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Ofner Gerald

Infineon Technologies

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Woerner Holger

Infineon Technologies

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Stuempfl Christian

Infineon Technologies

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Thumbs Josef

Infineon Technologies

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Wein Stefan

Infineon Technologies

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Maier Dominic

Infineon Technologies

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Fuergut Edward

Infineon Technologies

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Heindl Werner

Infineon Technologies

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Jerebic Simon

Infineon Technologies

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