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Woerner Holger

Infineon Technologies

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Publication

Featured researches published by Woerner Holger.

Archive | 2003

Elektronisches Bauteil und Verfahren zu seiner Herstellung

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2005

Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben

Fuergut Edward; Woerner Holger; Jerebic Simon; Bauer Michael

Archive | 2006

Surface mountable semiconductor component comprises plastic housing with solder contacts, and covering material

Woerner Holger; Bauer Michael

Archive | 2003

Electronic component, used in flip-chip technology, comprises semiconductor chip block with contact surfaces with contact humps on its active chip surface and intermediate support formed as wiring plate with wiring surfaces

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger; Heindl Werner

Archive | 2004

Messgerät für einen Biosensor in Chipkartenform und Messverfahren

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Bauer Michael; Woerner Holger

Archive | 2005

Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls

Woerner Holger; Fuergut Edward; Goller Bernd; Pohl Jens; Strobel Peter; Jerebic Simon; Hagen Robert-Christian

Archive | 2003

Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2002

Electronic component used as logical unit comprises first semiconductor chip and second semiconductor chip each having contact surfaces on their active surfaces, substrate with contact connection surfaces and external contact surfaces

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2008

Halbleiterbauelement mit elektromagnetischer Abschirmvorrichtung

Bauer Michael; Woerner Holger; Ernst Georg; Steiner Rainer; Birzer Christian; Vilsmeier Hermann

Archive | 2005

Sensorbauteil und nutzen zu seiner herstellung

Fuergut Edward; Goller Bernd; Hagen Robert-Christian; Jerebic Simon; Pohl Jens; Strobel Peter; Woerner Holger

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Collaboration

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Goller Bernd

Infineon Technologies

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Hagen Robert-Christian

Infineon Technologies

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Bauer Michael

Infineon Technologies

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Ofner Gerald

Infineon Technologies

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Stuempfl Christian

Infineon Technologies

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Thumbs Josef

Infineon Technologies

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Wein Stefan

Infineon Technologies

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Jerebic Simon

Infineon Technologies

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Fuergut Edward

Infineon Technologies

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Strobel Peter

Infineon Technologies

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