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Stuempfl Christian

Infineon Technologies

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Publication

Featured researches published by Stuempfl Christian.

Archive | 2003

Elektronisches Bauteil und Verfahren zu seiner Herstellung

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2003

Electronic component, used in flip-chip technology, comprises semiconductor chip block with contact surfaces with contact humps on its active chip surface and intermediate support formed as wiring plate with wiring surfaces

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger; Heindl Werner

Archive | 2008

Chip comprises contact element for electrical contact of chip, where contact element is covered with organic layer

Bauer Michael; Stuempfl Christian; Heitzer Ludwig

Archive | 2006

Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben

Bauer Michael; Strobel Peter; Pohl Jens; Stuempfl Christian; Heitzer Ludwig

Archive | 2004

Messgerät für einen Biosensor in Chipkartenform und Messverfahren

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Bauer Michael; Woerner Holger

Archive | 2003

Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2002

Electronic component used as logical unit comprises first semiconductor chip and second semiconductor chip each having contact surfaces on their active surfaces, substrate with contact connection surfaces and external contact surfaces

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger

Archive | 2012

Module mit einem Abschirm- und/oder Wärmeableitungselement und Verfahren zu ihrer Herstellung

Heitzer Ludwig; Stuempfl Christian; Bauer Michael

Archive | 2007

Halbleiterbauteil mit gedünntem Halbleiterchip und Verfahren zur Herstellung des gedünnten Halbleiterbauteils

Bauer Michael; Strobel Peter; Pohl Jens; Stuempfl Christian; Heitzer Ludwig

Archive | 2003

Electronic component comprises a semiconductor element mounted in a plastic housing, and electrical connections arranged between contact surfaces on an active surface of the element and contact connecting surfaces of conductor connections

Goller Bernd; Hagen Robert-Christian; Ofner Gerald; Stuempfl Christian; Thumbs Josef; Wein Stefan; Woerner Holger; Heindl Werner

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Collaboration

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Goller Bernd

Infineon Technologies

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Hagen Robert-Christian

Infineon Technologies

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Ofner Gerald

Infineon Technologies

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Bauer Michael

Infineon Technologies

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Woerner Holger

Infineon Technologies

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Heitzer Ludwig

Infineon Technologies

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Thumbs Josef

Infineon Technologies

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Wein Stefan

Infineon Technologies

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Pohl Jens

Infineon Technologies

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Strobel Peter

Infineon Technologies

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