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Gotthard Jungnickel

GlobalFoundries

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Publication

Featured researches published by Gotthard Jungnickel.

international symposium on the physical and failure analysis of integrated circuits | 2009

The effect of polyimide surface treatment on flip-chip assembly

M.C. Ong; X.L. Zhao; S.H. Lim; J.M. Chin; Chia-Ken Leong; Kevin W. Lim; Frank Kuechenmeister; Gotthard Jungnickel; Alexander Platz; Michael Su; Z. Syahirah; Z.L. Dong

This paper studied the effects of polyimide surface morphology and RIE treatment for lead-free C4 bumping of SOI device on assembly process by flip-chip technique. The characterizations were experimentally carried out with FTIR, AFM and CSAM. The process sequences have been optimized based on the DOE results.

Archive | 2007

A metallization layer stack without a terminal aluminum metal layer

Matthias Lehr; Frank Kuechenmeister; Lothar Lehmann; Marcel Wieland; Alexander Platz; Axel Walter; Gotthard Jungnickel

Archive | 2006

METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTROLLING THE REFLOW AMBIENT

Gotthard Jungnickel; Alexander Platz; Frank Kuechenmeister

Archive | 2011

Methods of forming bump structures that include a protection layer

Frank Kuechenmeister; Lothar Lehmann; Alexander Platz; Gotthard Jungnickel; Sven Kosgalwies

Archive | 2013

INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER

Frank Kuechenmeister; Lothar Lehmann; Alexander Platz; Gotthard Jungnickel; Sven Kosgalwies

Archive | 2011

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

Soeren Zenner; Gotthard Jungnickel; Frank Kuechenmeister

Archive | 2013

Halbleitervorrichtung und Verfahren zum Bilden von Höckerstrukturen mit einer Schutzschicht

Frank Kuechenmeister; Lothar Lehmann; Alexander Platz; Gotthard Jungnickel; Sven Kosgalwies

Archive | 2012

Verfahren zur Herstellung bleifreier Lotkugeln mit einer stabilen Oxidschicht auf der Grundlage eines Plasmaprozesses

Soeren Zenner; Gotthard Jungnickel; Frank Kuechenmeister

Archive | 2011

Rückseitenmetallisierung mit besserer Haftung in Hochleistungshalbleiterbauelementen

Soeren Zenner; Gotthard Jungnickel; Frank Kuechenmeister

Archive | 2010

BACK SIDE METALLIZATION WITH SUPERIOR ADHESION IN HIGH-PERFORMANCE SEMICONDUCTOR DEVICES

Soeren Zenner; Gotthard Jungnickel; Frank Kuechenmeister

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Collaboration

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Frank Kuechenmeister

GlobalFoundries

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Alexander Platz

GlobalFoundries

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Lothar Lehmann

GlobalFoundries

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Soeren Zenner

GlobalFoundries

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Kerstin Siury

Advanced Micro Devices

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Marcel Wieland

GlobalFoundries

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Sven Kosgalwies

GlobalFoundries

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Axel Walter

Advanced Micro Devices

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Matthias Lehr

GlobalFoundries

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Frank Kuchenmeister

GlobalFoundries

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