Matthias Lehr

Method for reducing resist poisoning during patterning of silicon nitride layers in a semiconductor device

Technique for forming a copper-based metallization layer including a conductive capping layer

TECHNIQUE FOR FORMING CONTACT INSULATION LAYERS AND SILICIDE REGIONS WITH DIFFERENT CHARACTERISTICS

Semiconductor substrate thinning method for manufacturing thinned die

METHOD OF FORMING AN INSULATING CAPPING LAYER FOR A COPPER METALLIZATION LAYER

Method of forming an insulating capping layer for a copper metallization layer by using a silane reaction

A semiconductor device including a reduced stress configuration for metal pillars

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

A metallization layer stack without a terminal aluminum metal layer

Method and semiconductor structure for monitoring the fabrication of interconnect structures and contacts in a semiconductor device