H.-S.P. Wong

Phase Change Memory

In this paper, recent progress of phase change memory (PCM) is reviewed. The electrical and thermal properties of phase change materials are surveyed with a focus on the scalability of the materials and their impact on device design. Innovations in the device structure, memory cell selector, and strategies for achieving multibit operation and 3-D, multilayer high-density memory arrays are described. The scaling properties of PCM are illustrated with recent experimental results using special device test structures and novel material synthesis. Factors affecting the reliability of PCM are discussed.

Metal–Oxide RRAM

In this paper, recent progress of binary metal-oxide resistive switching random access memory (RRAM) is reviewed. The physical mechanism, material properties, and electrical characteristics of a variety of binary metal-oxide RRAM are discussed, with a focus on the use of RRAM for nonvolatile memory application. A review of recent development of large-scale RRAM arrays is given. Issues such as uniformity, endurance, retention, multibit operation, and scaling trends are discussed.

Device scaling limits of Si MOSFETs and their application dependencies

This paper presents the current state of understanding of the factors that limit the continued scaling of Si complementary metal-oxide-semiconductor (CMOS) technology and provides an analysis of the ways in which application-related considerations enter into the determination of these limits. The physical origins of these limits are primarily in the tunneling currents, which leak through the various barriers in a MOS field-effect transistor (MOSFET) when it becomes very small, and in the thermally generated subthreshold currents. The dependence of these leakages on MOSFET geometry and structure is discussed along with design criteria for minimizing short-channel effects and other issues related to scaling. Scaling limits due to these leakage currents arise from application constraints related to power consumption and circuit functionality. We describe how these constraints work out for some of the most important application classes: dynamic random access memory (DRAM), static random access memory (SRAM), low-power portable devices, and moderate and high-performance CMOS logic. As a summary, we provide a table of our estimates of the scaling limits for various applications and device types. The end result is that there is no single end point for scaling, but that instead there are many end points, each optimally adapted to its particular applications.

A Compact SPICE Model for Carbon-Nanotube Field-Effect Transistors Including Nonidealities and Its Application—Part I: Model of the Intrinsic Channel Region

This paper presents a circuit-compatible compact model for the intrinsic channel region of the MOSFET-like single-walled carbon-nanotube field-effect transistors (CNFETs). This model is valid for CNFET with a wide range of chiralities and diameters and for CNFET with either metallic or semiconducting carbon-nanotube (CNT) conducting channel. The modeled nonidealities include the quantum confinement effects on both circumferential and axial directions, the acoustical/optical phonon scattering in the channel region, and the screening effect by the parallel CNTs for CNFET with multiple CNTs. In order to be compatible with both large-(digital) and small-signal (analog) applications, a complete transcapacitance network is implemented to deliver the real-time dynamic response. This model is implemented with an HSPICE. Using this model, we project a 13 times CV/I improvement of the intrinsic CNFET with (19, 0) CNT over the bulk n-type MOSFET at the 32-nm node. The model described in this paper serves as a starting point toward the complete CNFET-device model incorporating the additional device/circuit-level non-idealities and multiple CNTs reported in the paper of Deng and Wong.

A Compact SPICE Model for Carbon-Nanotube Field-Effect Transistors Including Nonidealities and Its Application—Part II: Full Device Model and Circuit Performance Benchmarking

This paper presents a complete circuit-compatible compact model for single-walled carbon-nanotube field-effect transistors (CNFETs) as an extension to Part 1 of this two-part paper. For the first time, a universal circuit-compatible CNFET model including the practical device nonidealities is implemented with HSPICE. In addition to the nonidealities included in the companion paper, this paper includes the elastic scattering in the channel region, the resistive source/drain (S/D), the Schottky-barrier resistance, and the parasitic gate capacitances. More than one nanotube per device can be modeled. Compared to silicon technology, the CNFETs show much better device performance based on the intrinsic gate-delay metric (six times for nFET and 14 times for pFET) than the MOSFET device at the 32-nm node, even with device nonidealities. This large speed improvement is significantly degraded (by a factor of five to eight) by interconnect capacitance in a real circuit environment. We performed circuit-performance comparison with all the standard digital library cells between CMOS random logic and CNFET random logic with HSPICE simulation. Compared to CMOS circuits, the CNFET circuits with one to ten carbon nanotubes per device is about two to ten times faster, the energy consumption per cycle is about seven to two times lower, and the energy-delay product is about 15-20 times lower, considering the realistic layout pattern and the interconnect wiring capacitance.

Synaptic electronics: materials, devices and applications

In this paper, the recent progress of synaptic electronics is reviewed. The basics of biological synaptic plasticity and learning are described. The material properties and electrical switching characteristics of a variety of synaptic devices are discussed, with a focus on the use of synaptic devices for neuromorphic or brain-inspired computing. Performance metrics desirable for large-scale implementations of synaptic devices are illustrated. A review of recent work on targeted computing applications with synaptic devices is presented.

An Electronic Synapse Device Based on Metal Oxide Resistive Switching Memory for Neuromorphic Computation

The multilevel capability of metal oxide resistive switching memory was explored for the potential use as a single-element electronic synapse device. TiN/HfOx/AlOx/ Pt resistive switching cells were fabricated. Multilevel resistance states were obtained by varying the programming voltage amplitudes during the pulse cycling. The cell conductance could be continuously increased or decreased from cycle to cycle, and about 105 endurance cycles were obtained. Nominal energy consumption per operation is in the subpicojoule range with a maximum measured value of 6 pJ. This low energy consumption is attractive for the large-scale hardware implementation of neuromorphic computing and brain simulation. The property of gradual resistance change by pulse amplitudes was exploited to demonstrate the spike-timing-dependent plasticity learning rule, suggesting that metal oxide memory can potentially be used as an electronic synapse device for the emerging neuromorphic computation system.

Device design considerations for double-gate, ground-plane, and single-gated ultra-thin SOI MOSFET's at the 25 nm channel length generation

We present a simulation-based analysis of device design at the 25 nm channel length generation. Double-gate, ground-plane, and single-gated ultra-thin SOI MOSFETs are considered. Dependencies of short-channel effects on channel thickness and ground-plane bias are illustrated. Two-dimensional field effects in the gate insulator (high k) and the buried insulator (low k) in single-gate SOI are studied.

Extension and source/drain design for high-performance FinFET devices

Double gate devices based upon the FinFET architecture are fabricated, with gate lengths as small as 30 nm. Particular attention is given to minimizing the parasitic series resistance. Angled extension implants and selective silicon epitaxy are investigated as methods for minimizing parasitic resistance in FinFETs. Using these two techniques high performance devices are fabricated with on-currents comparable to fully optimized bulk silicon technologies. The influence of fin thickness on device resistance and short channel effects is discussed in detail. Devices are fabricated with fins oriented in the and directions showing different transport properties.

Generalized scale length for two-dimensional effects in MOSFETs

We derive a new scale length for two-dimensional (2-D) effects in MOSFETs and discuss its significance. This derivation properly takes into account the difference in permittivity between the Si channel and the gate insulator, and thus permits an accurate understanding of the effects of using insufficiently scaled oxide or thicker higher permittivity gate insulators. The theory shows that the utility of higher dielectric constant insulators decreases for /spl epsiv///spl epsiv//sub 0/>-20, and that in no event should the insulator be thicker than the Si depletion depth. The approach is also applied to double-gated FET structures, resulting in a new more general scale length formula for them, too.