Hans Eichhorn

Large-field ion optics for projection and proximity printing and for maskless lithography (ML2)

Recent studies carried out with Infineon Technologies have shown the utility of Ion Projection Lithography (IPL) for the manufacturing of integrated circuits. In cooperation with IBM Storage Technology Division the patterning of magnetic films by resist-less Ion Projection Direct Structuring (IPDS) has been demonstrated. With masked ion beam proximity techniques unique capabilities for lithography on non-planar (curved) surfaces are outlined. Designs are presented for a masked ion beam proximity lithography (MIBPL) exposure tool with sub - 20 nm resolution capability within 88 mmo exposure fields. The possibility of extremely high reduction ratios (200:1) for high-volume ion projection mask-less lithography (IP-ML2) is discussed.

Large-field particle beam optics for projection and proximity printing and for maskless lithography

Recent studies have shown the utility of ion projection lithography (IPL) for the manufacturing of integrated circuits. In addition, ion projection direct structuring (IPDS) can be used for resistless, noncontact modification of materials. In cooperation with IBM Storage Technology Division, ion projection patterning of magnetic media layers has been demonstrated. With masked ion beam proximity techniques, unique capabilities for lithography on nonplanar (curved) surfaces are outlined. Designs are presented for a masked ion beam proximity lithography (MIBL) and masked ion beam direct structuring (MIBS) tool with sub-20-nm resolution capability within 88-mm□ exposure fields. The possibility of extremely high reduction ratios (200:1) for high-volume projection maskless lithography (projection-ML2) is discussed. In the case of projection-ML2 there are advantages of using electrons instead of ions. Including gray scaling, an improved concept for a ⩽50-nm projection-ML2 system is presented with the potential to meet a throughput of 20 wafers per hour (300 mm).

Application results achieved with LINUX cluster for data preparation

The ever growing layout complexity and escalating data volumes to be handled in high-end mask making processes using variable-shaped beam writers (VSB) require totally new computing and software solutions for data preparation. The high-performance, cost-effective LINUX Cluster is the ideal tool to manage these challenging tasks and, in addition, offers the advantage of being upgradable and expandable for meeting future lithography requirements. In this paper different computer configurations are analyzed. As a logical consequence the data conversion issue, including Proximity Effect Correction, of VSB e-beam systems and their specific data formats are also reflected in this investigation. Distributed and multi-threading computing is compared highlighting the advantages of the distributed approach.

Data prep: the bottleneck of future applications?

There is no doubt that shaped beam systems have been well established in the mask write community since the introduction of the 130nm technology node. Moreover, they are successfully advancing to conquer also the wafer direct write market. To be able to handle today and in the near future the tremendous data volumes with their characteristic complexity as well as to make use of such indispensable methods like PEC and Fogging corrections, new, sophisticated solutions are necessary to master the challenging 45nm technology node. However, we are aware that the 45nm node presents only an intermediate step, because, according to the international roadmap, we soon will be confronted with the hardware and software requirements of the next, the 32nm technology node. In this context it becomes more and more important to consider potential showstoppers, in our case the data preparation process To investigate this complex subject a Linux cluster computer featuring 3.6GHz clock rate CPUs, and a software package supporting distributed computing with a 64Bit version and address units down to 0.1nm were used. The work was focused on the performance of pattern samples down to the 45nm node. Both mask and wafer data as well as NIL template manufacturing were considered, data prep times and CPU loads were analysed. Furthermore, the user-friendly Leica Interface for Data Preparations (LINDA) was applied. In addition, an outlook to future hardware/software configurations for mastering the challenges of the 32nm node will be given. The results presented in this paper prove that data preparation is not the bottleneck of current and future applications.

Pattern data processing using 1-nm address grid

In the past years the address grid for layout design, data preparation and exposure has been constantly reduced. Currently the ITRS Roadmap specifies 4nm Mask Design Grid for the 100nm technology node. The possibilities and challenges of pattern data processing for the new generation of Leicas Shaped Beam (SB) exposure tools, called SB350MW, are highlighted in this paper. In this context such issues like data volume, data processing time and fracture quality for the new 1nm pattern data format are discussed in detail.

Electron-beam lithography data preparation based on multithreading MGS/PROXECCO

This paper will highlight an enhanced MGS layout data post processor and the results of its industrial application. Besides the preparation of hierarchical GDS layout data, the processing of flat data has been drastically accelerated. The application of the Proximity Correction in conjunction with the OEM version of the PROXECCO was crowned with success for data preparation of mask sets featuring 0.25 micrometers /0.18 micrometers integration levels.

Fast layout data processing and repetitive structure exposure for high-throughput e-beam lithography

Constantly growing chip areas, scaling down of pattern sizes, proximity corrections, OPC etc. gives rise to an expansion of layout data. The methods of our JENOPTIK universal exposure systems outlined in this paper serve the purpose of drastically reducing the enormous data volumes. ZBA e-beam systems are capable of processing repeated subpatterns down to runtime format. The ZBA-subpatterns may have any complexity and can be positioned randomly or as an array. Subpatterns are exploded by a fast specific hardware in the very last moment of exposure. Using such repetitive structures, data preprocessing, data transfer and data exposure times are considerably reduced. A suitable data preprocessor is described to provide detecting and saving of substructures.