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Harry Michael Siegel

STMicroelectronics

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Publication

Featured researches published by Harry Michael Siegel.

Archive | 2001

Capacitive fingerprint sensor with protective coating containing a conductive suspension

Fred P. Lane; Giovanni Gozzini; Harry Michael Siegel

Archive | 2004

Integrated circuit package with exposed die surfaces and auxiliary attachment

Anthong M. Chiu; Harry Michael Siegel

Archive | 1995

Surface mountable integrated circuit package with detachable module

Harry Michael Siegel; Michael J. Hundt; Krishnan Kelappan

Archive | 1994

Ball grid array package with detachable module

Robert H. Bond; Harry Michael Siegel

Archive | 2004

Method and system for removing heat from an active area of an integrated circuit device

Harry Michael Siegel

Archive | 1994

Surface mountable integrated circuit package with low-profile detachable module

Harry Michael Siegel; Tom Quoc Lao; Krishnan Kelappan; Michael J. Hundt

Archive | 1995

Method of mounting an integrated circuit to a mounting surface

Robert H. Bond; Harry Michael Siegel

Archive | 2002

Leadframeless package structure and method

Harry Michael Siegel; Anthony M. Chiu

Archive | 2003

System and method for direct convective cooling of an exposed integrated circuit die surface

Harry Michael Siegel; Anthony M. Chiu

Archive | 2003

Use of fluoropolymer coating for planarizing and passivating integrated circuit devices

Harry Michael Siegel; Fred P. Lane

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Collaboration

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Anthony M. Chiu

STMicroelectronics

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Michael J. Hundt

STMicroelectronics

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Fred P. Lane

STMicroelectronics

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Krishnan Kelappan

STMicroelectronics

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Anthong M. Chiu

STMicroelectronics

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Danielle A. Thomas

STMicroelectronics

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Robert H. Bond

STMicroelectronics

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Tom Quoc Lao

STMicroelectronics

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Antonio Do Bento Vieira

STMicroelectronics

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Richard P. Evans

STMicroelectronics

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