Robert H. Bond

New Process for Automated IC Assembly Manufacturing

A novel assembly process, designed for automation, has been developed and implemented. This paper describes both the equipmerit and processes employed by this technology. The key features of the design are the Use of the whole top surface of the chip for assembly, large bonding pads to reduce the required mechanical accuracies, and elimination of wire bonding and chip attach by bonding the chip directly to the leadframe. All bonds are being made simultaneously to a Strip of leadframe. Other features such as the thermal and electrical characteristics, corrosion resistance, and environmental stress results are also discussed.