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Michael J. Hundt

STMicroelectronics

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Publication

Featured researches published by Michael J. Hundt.

Archive | 1994

Ball-grid-array integrated circuit package with solder-connected thermal conductor

Robert H. Bond; Michael J. Hundt

Archive | 1997

Packaging for silicon sensors

Michael J. Hundt

Archive | 1993

Circuit assembly having interposer lead frame

Michael J. Hundt

Archive | 1995

Process for dissipating heat from a semiconductor package

Michael J. Hundt; Carlo Cognetti

Archive | 1996

Low-profile socketed packaging system with land-grid array and thermally conductive slug

Michael J. Hundt; Anthony M. Chiu

Archive | 1991

INTEGRATED CIRCUIT PACKAGE WITH MOLDED CELL

Michael J. Hundt; Krishnan Kelappan

Archive | 2004

Apparatus and method for attaching an integrating circuit sensor to a substrate

Michael J. Hundt; Tiao Zhou

Archive | 2002

Thin-film battery equipment

Michael J. Hundt; Frank Sigmund

Archive | 1995

Surface mountable integrated circuit package with detachable module

Harry Michael Siegel; Michael J. Hundt; Krishnan Kelappan

Archive | 1994

Surface mountable integrated circuit package with low-profile detachable module

Harry Michael Siegel; Tom Quoc Lao; Krishnan Kelappan; Michael J. Hundt

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Collaboration

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Robert H. Bond

STMicroelectronics

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Krishnan Kelappan

STMicroelectronics

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Harry Michael Siegel

STMicroelectronics

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Tiao Zhou

STMicroelectronics

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Anthony M. Chiu

STMicroelectronics

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Carlo Cognetti

STMicroelectronics

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Tom Quoc Lao

STMicroelectronics

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Frank Sigmund

STMicroelectronics

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D. Craig Dixon

STMicroelectronics

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Haibin Du

STMicroelectronics

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