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Key Engineering Materials | 2005

Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence

Xu Chen; Li Zhang; Masao Sakane; Haruo Nose

A series of tensile tests at constant strain rate were conducted on tin-lead based solders with different Sn content under wide ranges of temperatures and strain rates. It was shown that the stress-strain relationships had strong temperature- and strain rate- dependence. The parameters of Anand model for four solders were determined. The four solders were 60Sn-40Pb, 40Sn-60Pb, 10Sn-90Pb and 5Sn-95Pb. Anand constitutive model was employed to simulate the stress-strain behaviors of the solders for the temperature range from 313K to 398K and the strain rate range from 0.001%sP -1 P to 2%sP -1 P. The results showed that Anand model can adequately predict the rate- and temperature- related constitutive behaviors at all test temperatures and strain rates.

Journal of Electronic Packaging | 2003

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Haruo Nose; Masao Sakane; Yutaka Tsukada; Hideo Nishimura

Transactions of the Japan Society of Mechanical Engineers. A | 2002

Crack Propagation Behaviour of Four Types of Lead and Lead-Free Solders in Push-Pull Low Cycle Fatigue.

Haruo Nose; Masao Sakane; Mitsuo Yamashita; Kunio Shiokawa

Transactions of the Japan Society of Mechanical Engineers. A | 2003

Crack Initiation and Propagation Behavior of Three Types of Solders is Torsion Low Cycle Fatigue

Haruo Nose; Masao Sakane; Mitsuo Yamashita; Kunio Shiokawa

Transactions of the Japan Society of Mechanical Engineers. A | 1999

Effect of Temperature and Strain Rate on Mechanical Property of Sn-Pb Solders.

Haruo Nose; Masao Sakane; Yutaka Tsukada; Hideo Nishimura

The Proceedings of the Materials and Mechanics Conference | 2017

Small Sample Testing Technique for Solders

Noritake Hiyoshi; Takamoto Itoh; Keisuke Uenishi; Akira Ueno; Kazuhiro Ogawa; Fumio Ogawa; Yasuhiko Ono; Hideyuki Kanayama; Hajime Kubota; Masao Sakane; Shengde Zhang; Yutaka Tsukada; Hisashi Nakamoto; Mineo Nozaki; Haruo Nose; Hiroaki Hokazono; Toshio Honma; Tetsuya Tsutsumi; Mitsuo Yamashita; Takaei Yamamoto

Proceedings of JIEP Annual Meeting | 2005