Henning Schröder

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Interposers for SiP will become more and more important for advanced electronic systems. But through substrate vias are essential for the 3-D integration. Being a standard for laminate based materials this is much more complex for Si-wafers: High speed etching has to be combined with complex electrical isolation, diffusion barriers and void-free Cu-filling. Without doubt this can be solved in lab-scale but for high production scale cost is a tremendous barrier. Glass wafers with W-plugs have been intensively investigated in this paper. A new acronym has been posted to high-light this technology: TGV for Through Glass Vias. The results of modeling and simulation of TGV at RF/Microwave frequencies showed a very good compromise between wafer thickness, TGV-shape and via diameter for vertical metal plugs with 100 μm diameters in 500 μm thick glass wafer still very stable for thin film wafer processing without costly temporary wafer bonding processes. Therefore the HermeS® from Schott was chosen as the basis for a prototype of a bidirectional 4 × 10 Gbps electro-optical transceiver module. Thin film RDL and bumping of these wafers was possible without any modifications to Si-wafer. First thermal cycles showed very promising results for the reliability of this concept.

Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach

A flexible approach to producing optical interconnects on 609.6

glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects

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Non-invasive mobile monitoring of meat quality

609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6

Thin glass based packaging technologies for optoelectronic modules

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Polymer optical interconnects for PCB

101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6

Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

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Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides

101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section:

Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling

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Photonic System-in-Package technologies using thin glass substrates

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