Henricus V. Jansen

Ta2O5 as gate dielectric material for low-voltage organic thin-film transistors

In this paper we report the use of Ta2O5 as gate dielectric material for organic thin-film transistors. Ta2O5 has already attracted a lot of attention as insulating material for VLSI applications. We have deposited Ta2O5 thin-films with different thickness by means of electron-beam evaporation. Being a relatively low-temperature process, this method is particularly suitable for organic thin-film transistor fabrication on plastic substrates. Deposition and patterning are achieved in one step by the use of shadow masks. The dielectric can be evaporated on top of the semiconducting layer. In this way a large variety of structures can be realized. Poly(3-hexylthiophene) was used as semiconducting material in the transistor structure. Such transistors are operating at voltages smaller than −3 V. Having a high dielectric constant (r=21), Ta2O5 facilitates the charge carrier accumulation in the transistor channel at much lower electrical fields. The properties of the dielectric material as well as the operation of the organic transistors with a Ta2O5 gate dielectric are discussed.

Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as the bonding and sealing material. Measurements show that the influence of the wafer-level package on the RF performance can be made very small.

Novel RF-MEMS capacitive switching structures

This paper reports on novel RF-MEMS capacitive switching devices implementing an electrically floating metal layer covering the dielectric to ensure intimate contact with the bridge in the down state. This results in an optimal switch down capacitance and allows optimisation of the down/up capacitance ratio all that are not possible with standard characteristics compared to standard RF-MEMS capacitive switches, in the frequency range from 1 to 30 GHz. Down/up capacitance ratios higher than 450 have been measured, an improvement of a factor 34 over standard designs with equal size and using the same materials.