Heon-jong Shin

Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same

Method for manufacturing self-aligned BiCMOS

Semiconductor interconnection device with both n- and p-doped regions

Method of making semiconductor device having double spacer

Shared contact structure, semiconductor device and method of fabricating the semiconductor device

Methods of forming silicide layers on source/drain regions of MOS transistors and MOS transistors so formed

Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same

Semiconductor device having spacer and method of making same

Integrated circuit device including dummy patterns surrounding pads

Semiconductor wafer with improved step coverage along scribe lines