Heung-Sik Park
Samsung
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Publication
Featured researches published by Heung-Sik Park.
symposium on vlsi technology | 2005
Hye Jin Cho; Jeong Dong Choe; Jeong-Nam Han; Dong-Chan Kim; Heung-Sik Park; Doo-Hoon Goo; Ming Li; Chang Woo Oh; Dong-Won Kim; Tae-yong Kim; Choong-Ho Lee; Donggun Park; Kinam Kim; Byung-Il Ryu
In this paper, we demonstrate a 5nm width body-tied CMOS finFET on bulk Si for the first time. Also the threshold voltage control of the 5nm finFET is shown by using channel and pocket doping profile optimization along the narrow active fin. The excellent performance of finFET such as an excellent subthreshold swing (SS), and drain induced barrier lowering (DIBL) characteristics were found. And the systemic analyses of electrical characteristics dependencies on the fin width were evaluated for various fin width (5 /spl sim/ 100nm).
symposium on vlsi technology | 2017
Heung-Sik Park; K.-W. Lee; Sangho Song; K. G. Lee; Jai-Kwang Shin; V. Gangasani; Y. S. Shin; Donghun Kang; J.H. Park; Ki-whan Song; Gwan-Hyeob Koh; G.T. Jeong; Kyu-Charn Park; K. H. Kyung
RESET distribution of phase-change random access memory (PRAM) is highly related to heat fluctuations during RESET write (RESET<inf>W</inf>). In this work we investigate the effect of load resistance (R<inf>L</inf>) with constant voltage write method and propose new RESET<inf>W</inf> method with an optimal R<inf>L</inf> selection equation with considering Joule heating and thermoelectric effects. Since the optimal R<inf>L</inf> compensates for intrinsic dynamic resistance variation in PRAM, the heat fluctuation is reduced and the RESET distribution is improved. With fabricated PRAM TEG, we verify that optimal RL exists and achieve more improved RESET distribution with the optimized R<inf>L</inf> by 41% than with R<inf>L</inf> not optimized.
Japanese Journal of Applied Physics | 2008
Makoto Yoshida; Chul Ho Lee; Kyoung-Ho Jung; Chang-Kyu Kim; Hui-jung Kim; Heung-Sik Park; Won-Sok Lee; Keunnam Kim; Jae-Rok Kahng; Wouns Yang; Donggun Park
The body bias dependence of gate-induced drain leakage (GIDL) current for a fin field effect transistor fabricated on a bulk Si wafer (bulk FinFET) is investigated. The local damascene (LD) bulk FinFET is measured under various bias conditions and the effect of the body-bias-induced lateral electric field on GIDL current is evaluated. A lateral electric field shield effect under fin depleted condition is proposed and it is validated by the three-terminal band-to-band tunneling current model. The GIDL current of the bulk FinFET can be reduced by reducing the body bias, and an improvement in retention characteristics is expected.
Archive | 2003
Heung-Sik Park; Chang-Jin Kang; Tae-Hyuk Ahn; Kyeong-koo Chi; Sang-Hun Seo
Archive | 2011
Dong-Kwon Kim; Young-Ju Park; Dong-Hyuk Yeam; Yoo-Jung Lee; Myeong-cheol Kim; Do-hyoung Kim; Heung-Sik Park
Archive | 2007
Seung-pil Chung; Dong-Chan Kim; Chang-Jin Kang; Heung-Sik Park
Archive | 2005
Heung-Sik Park; Kyeong-koo Chi; Chang-Jin Kang
Archive | 2008
Heung-Sik Park; Jun-ho Yoon; Cheol-kyu Lee; Joon-soo Park
Archive | 2015
Doo-Young Lee; Do-hyoung Kim; Johnsoo Kim; Heung-Sik Park; Hongsik Shin; Young-Hun Choi
Archive | 2015
Kangmin Jeon; Kyung-Sun Kim; Dougyong Sung; Tae-Hwa Kim; Heung-Sik Park; Jung Min Kim