Hilal Ezzeddine

New Wideband Miniature Branchline Coupler on IPD Technology for Beamforming Applications

In this paper, we present a new wideband miniature branchline coupler as a key circuit to be integrated in 60-GHz packaged beamforming networks for phased-array antennas. First, the integrated passive device (IPD) technology from STMicroelectronics is investigated in the mm-wave range through the simulation, fabrication, and measurements of a microstrip line and a simple hybrid coupler. Then, a novel coupler topology with emphasis on miniaturization and broadband operation is theorized. Analytical equations are derived and a 60-GHz coupler is optimized on IPD technology. Measurement results are discussed and compared with state-of-the art publications. The whole 57-66-GHz bandwidth is efficiently covered with the three following performance: -10-dB impedance matching, ±1-dB amplitude imbalance, and ±5° phase imbalance. As an application example, the novel coupler is integrated into a 4 × 4 Butler matrix suitable for an array-antenna demonstrating stateof-the art performance in terms of insertion loss and phase error. The measurement of different samples shows low variation of the IPD process because of very good reproducibility making it a suitable candidate for circuits operating in the 60-GHz band.

A 1.2 GHz semi-digital reconfigurable FIR bandpass filter with passive power combiner

This paper presents a reconfigurable semi-digital RFFIR filter suitable for digital transmitters using 1-bit DeltaSigma signal generation. A transmission line based 5-channel power combiner allows both increase of output power and programmable filtering of the signal. A prototype has been built with 65 nm CMOS and Integrated Passive Devices (IPD) technologies. The system exhibits a 14 dB power gain for a peak power of 17 dBm at 1.2 GHz and an attenuation of out-of band noise of up to 15 dB. CMOS and IPD chip size are respectively 2.05 mm2 and 17.78 mm2.

Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.

A 120 GHz 3D-printed plastic elliptical lens antenna with an IPD patch antenna source

In this paper, we investigate the performance of a 3D-printed plastic lens operating in the 120 GHz frequency band. An Integrated Passive Device module with built-in linearly polarized patch antenna is used as the source of the lens. The profile of the lens is based on elliptical shape. It is first optimized with Geometrical Optics (GO) and Physical Optics (PO) methods. Then, full-wave simulations are conducted to fine tune the overall antenna-structure. Using a lens height of 10 mm, the overall antenna has a simulated realized gain higher than 15 dBi from 120 GHz to 130 GHz. The lens and the patch antenna have just been manufactured and measurements will be presented in the final paper.

Miniaturized hybrid Antenna combining Si and IPD™ technologies for 60 GHz WLAN Applications

This paper presents the design of a packaged antenna including glass substrate. A square patch antenna is implemented on glass substrate exploiting IPD™ technology, and excited by a coupling slot implemented on BiCMOS B9MW technology (Low Resistivity (LR) Si - ρ = 12 Ω.cm). The described solution solves the interconnection problem between Silicon Integrated Circuits (ICs) and the antenna. The excitation structure is integrated on Silicon substrate using conventional process, thus reducing insertion losses usually caused by flip-chip or assembling techniques. The second advantage of this solution is the co-integration of the coupling slot with the RF front-end. This permits to match the antenna input impedance to the PA output impedance, with consequently improved power budget efficiency. This antenna achieves a simulated gain of 5 dBi at 60 GHz and a relative bandwidth of 8 %. A preliminary antenna on alumina and glass substrates has been realized in order to verify the flip-chip assembly process. The measurements results are in good agreement with simulation.

60 GHz patch antenna using IPD technology

In this paper, we present a high efficiency antenna for 60 GHz low-cost packaged modules. This antenna is fabricated using IPD™ technology which is flip-chipped on a PCB Taclamplus substrate. A microstrip line etched on this Taclamplus substrate from Taconic is directly coupled to the upper patch antenna fabricated in the IPD™ technology from ST Microelectronics. A -10dB bandwidth of 10 GHz is obtained centered on 60 GHz frequency.

Planar antennas on Integrated Passive Device technology for biomedical applications

In this paper, we present the design of electrically small antennas for biomedical application at 2.4 GHz. Performance of two different antennas built using the Integrated Passive Devices (IPD) technology from STMicroelectronics is investigated. Two monopoles miniaturized with the meandered technique are studied. Their quality factor Qz is calculated from their input impedance and compared with the quality factor limits for planar antennas given by Gustafsson. Therefore, we determine which configuration offers the best trade-off between radiation efficiency and quality factor Qz.

Design of a miniaturized Butler matrix in IPD process for 60 GHz switched-beam antenna arrays

In this paper, we present the design and realization of a miniaturized Butler matrix for 60 GHz applications. The matrix is realized using the IPD process from ST Microelectronics, Tours. Using new miniaturized branchline couplers and the IPD process, the Butler size is reduced by 90%. Simulation results show an insertion loss of 2.25 ± 0.95 dB and a maximum phase error of 10° in the whole 57-66 GHz band.

PCB Integration of a Vivaldi Antenna on IPD Technology for 60-GHz Communications

The integration of a Vivaldi antenna on a printed circuit board (PCB) targeting 60-GHz WiGig applications is presented in this letter. The integrated passive device (IPD)technology from STMicroelectronics based on a glass substrate is used for the antenna manufacturing. In free space, the radiation pattern measurements show a realized gain higher than 4 dBi in the endfire direction from 56 to 65 GHz. The impact of the integration of the antenna on the PCB is investigated in details showing reasonable disturbance of the reflection coefficient, but strong modifications of the radiation pattern, especially the pointing direction of the main beam. From the analysis of the surface waves propagating along the PCB when the Vivaldi is integrated, a novel topology is proposed to preserve the main radiation in the endfire direction with enhanced realized gain.

Three approaches for the realization of a Chebyshev cross-coupled UWB filter

This paper deals with the synthesis and realization of a UWB filter in the [3.168, 4.752] GHz band using a thin film IPD technology and a 4th order Chebyshev cross-coupled architecture that allows us to introduce two finite transmission zeroes out of band. In order to realize this filter, three approaches of realization were considered. The first approach was a classical use of the available technology, i.e. lumped elements. The second was the introduction of distributed capacitors to reduce the filter response sensitivity towards the industrial process variation. The last, dictated by size issues, consisted in using electromagnetic coupling in order to suppress a lumped inductor from the circuit. The three versions are described and results are discussed.