Hiroko Koike

Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion

Semiconductor device and process of producing same

Semiconductor device module and a part thereof

Substrate-embedded capacitor, production method thereof, and circuit board

Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method

Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate

Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board

Method of formation of a capacitor with a solid electrolyte layer comprising an organic semiconductor, and method of production of circuit board

Chip carrier with fibrous heat dissipation plate

Condenser and circuit board, method for producing the same