Hirotsugu Inoue

Time frequency analysis of dispersive waves by means of wavelet transform

A new approach is presented for investigating the dispersive character of structural waves. The wavelet transform is applied to the time-frequency analysis of dispersive waves. The flexural wave induced in a beam by lateral impact is considered. It is shown that the wavelet transform using the Gabor wavelet effectively decomposes the strain response into its time-frequency components. In addition, the peaks of the time-frequency distribution indicate the arrival times of waves. By utilizing this fact, the dispersion relation of the group velocity can be accurately identified for a wide range of frequencies.

Experimental wavelet analysis of flexural waves in beams

The wavelet transform (WT) is applied to the time-frequency analysis of flexural waves in beams. The WT with the Gabor wavelet decomposes a dispersive wave into each frequency component in the time domain, which enables one to determine the traveling time of a wave along the beam at each frequency. By utilizing this fact, a method is developed to identify the dispersion relation and impact site of beams.

Experimental Investigation on the Interface Properties Evaluation in Piezoelectric Layered Structures by Love Waves Propagation

The linear ultrasonic technique has been extensively used as a powerful, non-destructive test tool for reliability testing and failure analysis of electronic packaging. This is used most often in the inspection of defects such as delaminations, voids, or cracks through use of a SAM (Scanning Acoustic Microscope). Then, as the reliability level that is required of electronic packaging becomes higher and the thickness of package becomes thinner, the possible defect which needs to be detected becomes smaller. In the conventional SAM, however it is very difficult to detect small defects less than m µ 1 . 0 , such as micro-delaminations. In order to solve such a problem, this paper proposes a nonlinear ultrasonic method, where the nonlinearity caused by the effect of crack-face interactions is considered. The basic concept of this method involves harmonic frequencies that are generated in the transmitted ultrasonic wave due to the partial contact at the interface of micro-delamination. As an evaluation index, the nonlinear parameter dependent on the amplitude of the second order harmonic frequency component is obtained by spectral analysis of the transmitted signal. Experimental results show that the nonlinear parameter has good correlation with the micro-gap and the proposed method can detect the micro-delamination even less than nm 1 .

UV-Irradiation Effects on Interfacial Strength between Thin Ceramic Film and Polymer Substrate

This aim of this study is to investigate the effect of UV (Ultra Violet ray) irradiation on the interfacial adhesion strength between thin ceramic films and polymer substrate. Electric conductive films based on polymer substrates have attracted attention for use in flexible optoelectronic devices. It is well known that the mechanical properties of polymeric materials are degraded by UV irradiation. Therefore, it is considered that the UV irradiation also affects the interfacial adhesion strength between ceramic coating and polymer substrate. The interfacial adhesion strength was measured by Multi-stages peel test. The results show that the interfacial strength decreases with UV irradiation. However, if a filter layer is installed between ceramic and polymer substrate, the degradation ratio becomes small.

Boundary element analysis of thermoelastic contact problems

A boundary element method (BEM) is applied to thermoelastic contact problems where thermal resistance at the contact interface is not negligible. The displacement, traction, temperature and temperature gradient in the contact zone are unknown quantities to be determined numerically. Due to the existence of thermal resistance, temperature and stress fields are mutually coupled. To solve the problem, two kinds of methods are presented. In the first method, the solution is obtained by minimizing a suitably defined objective function. In the second method, discretized equations of each of the bodies in contact are computed alternately until all prescribed boundary conditions are satisfied. The applicability of these methods to practical problems is examined through several numerical examples.

A phenomenological constitutive model constructed for PC/ABS blends

Based on previous available constitutive models, a phenomenological constitutive model has been constructed and is proposed to describe the strain, strain rate and temperature dependentdeformation behavior of PC/ABS blends. In this paper, four quasi-static uniaxial tension tests of a specimen tested at different strain rates and temperatures were used to identify the constitutive model constants. By using the proposed constitutive model, predicting the stress-strain behavior of the PC/ABS blend tested at certain strain rate and different temperatures compares well to the behavior exhibited from the tests. From comparison between the DSGZ and the proposed models, proposed model shows a better prediction. Evaluation of the proposed constitutive model was also presented and it has revealed that the proposed model might have a potential to be used for predicting a wide range of temperatures and high strain rates behavior of PC/ABS blends.

Estimation of Impact Force by an Inverse Analysis

An inverse problem of impact force is studied, in which an impact force acting on a body of arbitrary shape is estimated from responses induced at any point of the body. The noncausal Wiener filtering theory and the singular value decomposition (SVD) technique are employed for improving the accuracy of estimation. The present method is applied to the measurement of the impact force acting on a GFRP plate and its effectiveness is examined.

Effect of Peel Rate on Interfacial Strength

Adhesives are widely used in industrial world. However, it is difficult to characterize their mechanical properties because those strongly depend on environmental and mechanical conditions such as temperature, humidity or strain rate. In this paper, we focus on the strain rate dependence of the interfacial strength and investigate the interfacial strength by peel tests under several peel rates. The results show that, in low rate case (under 10-2 mm/s), the interfacial strength was constant and, in middle rate case (10-2 to 103 mm/s), the interfacial strength increased with the peel rate. Over 103 mm/s case, the interfacial strength became lower than those in middle rate cases. From the observation of peeling front by a high speed video camera, the deformation behavior of adhesives changed with the peel rate.

Simulation of Deformation Behavior of Polymeric Materials by Chain Network Model

The mechanical properties of polymers are strongly influenced by meso-scale (10-9~10-3 m) structure such as entanglement, molecular weight distribution, orientation, etc. It is important to understand the relationship between the mechanical properties of polymeric material and meso-scale structure. Some studies related to the relationship have been made. However detail of the relationship is still unclear. Especially, the studies emphasize on entanglement and branch are few. This study aims to clear the role of entanglement and branch for mechanical properties by simulating the meso-scale structure using 3D network models. In the models, there are two structures considered. One of them has no branch, and, others have branch. Large strain deformation of network models is evolved via improved molecular dynamics analysis.

Evaluation of fatigue strength for solder joints after thermal aging

Recently, preventing environmental pollutions, leadfree(Pb-free) solders areabout toreplace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys areleading candidates for leadfree solders. Inthis study, wecarried outboard level fatigue tests andinvestigated thefatigue life ofseveral lead free solder joints. Also, theeffects ofpadfinish metals and their thickness wereinvestigated.