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Toshikazu Shibuya

Oita University

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Publication

Featured researches published by Toshikazu Shibuya.

Theoretical and applied mechanics Japan | 2002

Axisymmetric Contact Problem of an Elastic Half-Space Indented by a Concave or Convex Rigid Punch.

Takao Akiyama; Toshiaki Hara; Toshikazu Shibuya

Journal of Electronic Packaging | 2002

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya

Proceedings of the 1992 Annual Meeting of JSME/MMD | 2001

347 Development of Contact-Type Line-Focus Ultrasonic Probe

Hirotsugu Inoue; Eiji Kusabiraki; Kikuo Kishimoto; Toshikazu Shibuya

Archive | 2001

NDE of plates and coatings using contact-type line-focus ultrasonic probe

Hirotsugu Inoue; Kikuo Kishimoto; Toshikazu Shibuya

The proceedings of the JSME annual meeting | 2000

Finite Element Analysis on Fracture Behavior of the interface crack with plastic deformation

Masaki Omiya; Keisuke Suzuki; Hirotsugu Inoue; Kikuo Kishimoto; Toshikazu Shibuya

The Proceedings of The Computational Mechanics Conference | 2000

A Novel Technique for Stress Separation in Thermoelastic Stress Analysis

Yoshihiro Hirokawa; Hirotsugu Inoue; Keisuke Hayabusa; Kikuo Kishimoto; Toshikazu Shibuya

The Proceedings of the Materials and Mechanics Conference | 2008

OS0124 Effect of Heat Conduction on Bending Stress Measurement by Thermoelastic Method

Hirotsugu Inoue; Yuhki Matsuoka; Yosuke Torii; Toshikazu Shibuya

Proceedings of the 1992 Annual Meeting of JSME/MMD | 2002

A Study of the Effect of Heat Conduction in Thermoelastic Stress Analysis

Hirotsugu Inoue; Kazutaka Kato; Kikuko Kishimoto; Toshikazu Shibuya

Proceedings of the 1992 Annual Meeting of JSME/MMD | 2002

A New Method for Stress Separation in Thermoelastic Stress Analysis : Improvement of Accuracy by Filtering

Yoshihiro Hirokawa; Hirotsugu Inoue; Kikuo Kishimoto; Toshikazu Shibuya

The proceedings of the JSME annual meeting | 2001

K-0643 Effect of Thermal Aging on Interface Strength for Pb-free Solder Joints

Masaki Omiya; Takao Harada; Kikuo Kishimoto; Hirotsugu Inoue; Toshikazu Shibuya; Masazumi Amagai

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Collaboration

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Kikuo Kishimoto

Tokyo Institute of Technology

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Hirotsugu Inoue

Tokyo Institute of Technology

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Masaki Omiya

Keio University

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Masazumi Amagai

Texas Instruments

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Keisuke Hayabusa

Ebara Corporation

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Mitsuo Notomi

Meiji University

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Noriyasu Kawamura

Toshiba

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Takao Akiyama

Yamagata University

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Takashi Kawakami

Toyama Prefectural University

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Toshiaki Hara

Niigata University

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