Hiroyoshi Kokaku | Researchain

Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Hiroyoshi Kokaku is active.

Explore More

Publication

Featured researches published by Hiroyoshi Kokaku.

Kobunshi Ronbunshu | 1988

Studies on the durability of plastics filled with filler reinforcements. V. The surface reflectance of polypropylene molds filled with granular inorganic materials.

Tsuguo Kobayashi; Hideki Asano; Tetsuo Ishikawa; Hiroyoshi Kokaku

ポリブロピレンに炭酸カルシウム, タルクを充てんした成形品表面の光沢について検討し, 次のことを明らかにした. (1) フィラー充てんによるPP成形品表面光沢の低下は, フィラーの表面への突き出し, 気泡などによる凸凹の発生に起因する. (2) 表面層は, 比較的樹脂分が多い状態であり, 界面活性剤などの添加剤により表面の平滑性を良くして光沢を10～40%向上させることができる. (3) フィラーの充てん率, 粒子径の増加によって, 光沢は低下する, CaCO3充てん率20wt%で平均粒子径0.07μmのものの光沢は3.8μmのものに比べ約30%以上に向上する. (4) フィラー充てんPPの光沢はマトリックスPPの光沢に大きく依存する, 光沢とともに弾性率, 衝撃値にバランス良い特性のものは, ホモ, ランダム, ブロックコポリマーの各種ポリマーの特性を生かしたポリマーブレンドにより得ることができる.

Archive | 2003

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Akira Nagai; Shuji Eguchi; Masahiko Ogino; Masanori Segawa; Toshiak Ishii; Nobutake Tsuyuno; Hiroyoshi Kokaku; Rie Hattori; Makoto Morishima; Ichiro Anjoh; Kunihiro Tsubosaki; Chuichi Miyazaki; Makoto Kitano; Mamoru Mita; Norio Okabe

Polymer Engineering and Science | 2006

Calcium borate flame retardation system for epoxy molding compounds

Toshiaki Ishii; Hiroyoshi Kokaku; Akira Nagai; Takafumi Nishita; Masa-aki Kakimoto

Archive | 1983

Resin sealed semiconductor devices and a process for manufacturing the same

Shuji Eguchi; Yasuhide Sugawara; Toshiaki Ishii; Hiroyoshi Kokaku; Akira Nagai; Ryou Moteki; Ogino Masahiko; Masanori Segawa; Rie Hattori; Nobutake Tsuyuno; Takumi Ueno; Atsushi Nakamura; Asao Nishimura

Archive | 1998

Semiconductor device and wiring tape for semiconductor device

Masahiko Ogino; Shuji Eguchi; Akira Nagai; Takumi Ueno; Masanori Segawa; Hiroyoshi Kokaku; Toshiaki Ishii; Ichiro Anjoh; Asao Nishimura; Chuichi Miyazaki; Mamoru Mita; Norio Okabe

Archive | 1978

Polypropylene resin compositions and moldings thereof

Hideki Asano; Hiroyoshi Kokaku; Katsuhito Suzuki; Kenichi Saida

Archive | 1998

Semiconductor device having a porous buffer layer for semiconductor device

Masahiko Ogino; Shuji Eguchi; Akira Nagai; Takumi Ueno; Masanori Segawa; Hiroyoshi Kokaku; Toshiaki Ishii; Ichiro Anjoh; Asao Nishimura; Chuichi Miyazaki; Mamoru Mita; Norio Okabe

Archive | 1989

Electrophotographic photoreceptor and method of producing the same.

Akio Mukoh; Mitsuoshi Shoji; Shigeo Suzuki; Takayuki Nakakawaji; Yutaka Ito; Shigeki Komatsuzaki; Ryuichi Shimizu; Hiroyoshi Kokaku; Tsuneaki Kawanishi; Atsushi Kakuta

Archive | 2001