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Dive into the research topics where Hiroyoshi Kokaku is active.

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Featured researches published by Hiroyoshi Kokaku.


Kobunshi Ronbunshu | 1988

Studies on the durability of plastics filled with filler reinforcements. V. The surface reflectance of polypropylene molds filled with granular inorganic materials.

Tsuguo Kobayashi; Hideki Asano; Tetsuo Ishikawa; Hiroyoshi Kokaku

ポリブロピレンに炭酸カルシウム, タルクを充てんした成形品表面の光沢について検討し, 次のことを明らかにした. (1) フィラー充てんによるPP成形品表面光沢の低下は, フィラーの表面への突き出し, 気泡などによる凸凹の発生に起因する. (2) 表面層は, 比較的樹脂分が多い状態であり, 界面活性剤などの添加剤により表面の平滑性を良くして光沢を10~40%向上させることができる. (3) フィラーの充てん率, 粒子径の増加によって, 光沢は低下する, CaCO3充てん率20wt%で平均粒子径0.07μmのものの光沢は3.8μmのものに比べ約30%以上に向上する. (4) フィラー充てんPPの光沢はマトリックスPPの光沢に大きく依存する, 光沢とともに弾性率, 衝撃値にバランス良い特性のものは, ホモ, ランダム, ブロックコポリマーの各種ポリマーの特性を生かしたポリマーブレンドにより得ることができる.


Archive | 2003

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Akira Nagai; Shuji Eguchi; Masahiko Ogino; Masanori Segawa; Toshiak Ishii; Nobutake Tsuyuno; Hiroyoshi Kokaku; Rie Hattori; Makoto Morishima; Ichiro Anjoh; Kunihiro Tsubosaki; Chuichi Miyazaki; Makoto Kitano; Mamoru Mita; Norio Okabe


Polymer Engineering and Science | 2006

Calcium borate flame retardation system for epoxy molding compounds

Toshiaki Ishii; Hiroyoshi Kokaku; Akira Nagai; Takafumi Nishita; Masa-aki Kakimoto


Archive | 1983

Resin sealed semiconductor devices and a process for manufacturing the same

Shuji Eguchi; Yasuhide Sugawara; Toshiaki Ishii; Hiroyoshi Kokaku; Akira Nagai; Ryou Moteki; Ogino Masahiko; Masanori Segawa; Rie Hattori; Nobutake Tsuyuno; Takumi Ueno; Atsushi Nakamura; Asao Nishimura


Archive | 1998

Semiconductor device and wiring tape for semiconductor device

Masahiko Ogino; Shuji Eguchi; Akira Nagai; Takumi Ueno; Masanori Segawa; Hiroyoshi Kokaku; Toshiaki Ishii; Ichiro Anjoh; Asao Nishimura; Chuichi Miyazaki; Mamoru Mita; Norio Okabe


Archive | 1978

Polypropylene resin compositions and moldings thereof

Hideki Asano; Hiroyoshi Kokaku; Katsuhito Suzuki; Kenichi Saida


Archive | 1998

Semiconductor device having a porous buffer layer for semiconductor device

Masahiko Ogino; Shuji Eguchi; Akira Nagai; Takumi Ueno; Masanori Segawa; Hiroyoshi Kokaku; Toshiaki Ishii; Ichiro Anjoh; Asao Nishimura; Chuichi Miyazaki; Mamoru Mita; Norio Okabe


Archive | 1989

Electrophotographic photoreceptor and method of producing the same.

Akio Mukoh; Mitsuoshi Shoji; Shigeo Suzuki; Takayuki Nakakawaji; Yutaka Ito; Shigeki Komatsuzaki; Ryuichi Shimizu; Hiroyoshi Kokaku; Tsuneaki Kawanishi; Atsushi Kakuta


Archive | 2001

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Toshiaki Ishii; Hiroyoshi Kokaku; Akira Nagai; Takao Miwa


Archive | 1991

Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same

Hiroyoshi Kokaku; Masatsugu Ogata; Masanori Segawa; Hiroshi Hozoji; Akio Nishikawa; Fumio Sato

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