Masanori Segawa | Researchain

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Archive | 1995

Semiconductor device having a stress relieving mechanism

Masahiko Ogino; Akira Nagai; Shuji Eguchi; Toshiaki Ishii; Masanori Segawa; Haruo Akahoshi; Akio Takahashi; Takao Miwa; Naotaka Tanaka; Ichirou Anjou

Archive | 1995

Semiconductor device and its mounting structure

Masahiko Ogino; Akira Nagai; Shuji Eguchi; Toshiaki Ishii; Masanori Segawa; Haruo Akahoshi; Akio Takahashi; Takao Miwa; Naotaka Tanaka; Ichirou Anjou

Archive | 2003

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Akira Nagai; Shuji Eguchi; Masahiko Ogino; Masanori Segawa; Toshiak Ishii; Nobutake Tsuyuno; Hiroyoshi Kokaku; Rie Hattori; Makoto Morishima; Ichiro Anjoh; Kunihiro Tsubosaki; Chuichi Miyazaki; Makoto Kitano; Mamoru Mita; Norio Okabe

Archive | 2001

Method of making a semiconductor device having a stress relieving mechanism

Masahiko Ogino; Akira Nagai; Shuji Eguchi; Toshiaki Ishii; Masanori Segawa; Haruo Akahoshi; Akio Takahashi; Takao Miwa; Naotaka Tanaka; Ichirou Anjou

Archive | 1983

Resin sealed semiconductor devices and a process for manufacturing the same

Shuji Eguchi; Yasuhide Sugawara; Toshiaki Ishii; Hiroyoshi Kokaku; Akira Nagai; Ryou Moteki; Ogino Masahiko; Masanori Segawa; Rie Hattori; Nobutake Tsuyuno; Takumi Ueno; Atsushi Nakamura; Asao Nishimura

Archive | 1998

Semiconductor device and wiring tape for semiconductor device

Masahiko Ogino; Shuji Eguchi; Akira Nagai; Takumi Ueno; Masanori Segawa; Hiroyoshi Kokaku; Toshiaki Ishii; Ichiro Anjoh; Asao Nishimura; Chuichi Miyazaki; Mamoru Mita; Norio Okabe

Archive | 1994

MULTILAYER PRINTED WIRING BOARD AND ITS MOUNTING STRUCTURE

Kuniyuki Eguchi; Toshiaki Ishii; Hiroyoshi Kokado; Akira Mogi; Akira Nagai; Masahiko Ogino; Masanori Segawa; 博義小角; 永井晃; 州志江口; 正則瀬川; 利昭石井; 亮茂木; 雅彦荻野

Archive | 1998

Semiconductor device having a porous buffer layer for semiconductor device

Masahiko Ogino; Shuji Eguchi; Akira Nagai; Takumi Ueno; Masanori Segawa; Hiroyoshi Kokaku; Toshiaki Ishii; Ichiro Anjoh; Asao Nishimura; Chuichi Miyazaki; Mamoru Mita; Norio Okabe

Archive | 1996

Thermosetting resin composition for sealing semiconductor and semiconductor device using the same and its production

Kuniyuki Eguchi; Rie Hattori; Toshiaki Ishii; Hiroyoshi Kokado; Akira Nagai; Masahiko Ogino; Masanori Segawa; 博義小角; 理恵服部; 永井晃; 州志江口; 正則瀬川; 利昭石井; 雅彦荻野

Archive | 1996

Resin-sealed semiconductor device and its production

Kuniyuki Eguchi; Toshiaki Ishii; Hiroyoshi Kokado; Akira Mogi; Akira Nagai; Atsushi Nakamura; Asao Nishimura; Masahiko Ogino; Masanori Segawa; Yasuhide Sugawara; Enjiyou Tsuyuno; Takumi Ueno; 巧上野; 篤中村; 博義小角; 永井晃; 州志江口; 正則瀬川; 利昭石井; 亮茂木; 雅彦荻野; 泰英菅原; 朝雄西村; 円丈露野

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