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Hoe Chul Kim

Seoul National University

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Publication

Featured researches published by Hoe Chul Kim.

Journal of The Electrochemical Society | 2013

Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor

Myung Jun Kim; Hoe Chul Kim; Seunghoe Choe; Ji Yoon Cho; Donghyung Lee; Il Jung; Won-Seob Cho; Jae Jeong Kim

Electrochimica Acta | 2015

Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums

Myung Jun Kim; Youngran Seo; Hoe Chul Kim; Yoonjae Lee; Seunghoe Choe; Young Gyu Kim; Sung Ki Cho; Jae Jeong Kim

Journal of The Electrochemical Society | 2013

Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling

Seunghoe Choe; Myung Jun Kim; Hoe Chul Kim; Sung Ki Cho; Sang Hyun Ahn; Soo-Kil Kim; Jae Jeong Kim

Journal of The Electrochemical Society | 2015

Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives

Hoe Chul Kim; Seunghoe Choe; Ji Yoon Cho; Donghyung Lee; Il Jung; Won-Seob Cho; Myung Jun Kim; Jae Jeong Kim

Journal of The Electrochemical Society | 2013

Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling

Seunghoe Choe; Myung Jun Kim; Hoe Chul Kim; Taeho Lim; Kyung Ju Park; Sung Ki Cho; Soo-Kil Kim; Jae Jeong Kim

Journal of The Electrochemical Society | 2016

The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling

Myung Jun Kim; Hoe Chul Kim; Jae Jeong Kim

Journal of The Electrochemical Society | 2014

Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization

Hoe Chul Kim; Myung Jun Kim; Seunghoe Choe; Taeho Lim; Kyung Ju Park; Kwang Hwan Kim; Sang Hyun Ahn; Soo-Kil Kim; Jae Jeong Kim

Journal of The Electrochemical Society | 2013

Direct Electrodeposition of Cu on Ru-Al2O3 Layer

Myung Jun Kim; Hoe Chul Kim; Soo-Hyun Kim; Seungmin Yeo; Oh Joong Kwon; Jae Jeong Kim

Journal of The Electrochemical Society | 2016

Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition—Its Interaction with Cuprous Ion from Comproportionation

Sung Ki Cho; Hoe Chul Kim; Myung Jun Kim; Jae Jeong Kim

Journal of The Electrochemical Society | 2016

Communication—Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance

Myung Jun Kim; Youngran Seo; Jung Hwan Oh; Yoonjae Lee; Hoe Chul Kim; Young Gyu Kim; Jae Jeong Kim

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Myung Jun Kim

Seoul National University

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Jae Jeong Kim

Philips

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Seunghoe Choe

Seoul National University

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Soo-Kil Kim

Chung-Ang University

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Kwang Hwan Kim

Seoul National University

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Taeho Lim

Seoul National University

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Sung Ki Cho

Seoul National University

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Anna Lee

Seoul National University

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Kyung Ju Park

Seoul National University

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Jae Jeong Kim

Philips

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