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Hooman Hafezi

Applied Materials

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Publication

Featured researches published by Hooman Hafezi.

Archive | 2006

Auxiliary electrode encased in cation exchange membrane tube for electroplating cell

Saravjeet Singh; Hooman Hafezi; Manoocher Birang; Aron Rosenfeld; Joseph Behnke

Archive | 2006

Apparatus and method for improving uniformity in electroplating

Hooman Hafezi; Aron Rosenfeld

Archive | 2006

Method of direct plating of copper on a ruthenium alloy

Hooman Hafezi; Aron Rosenfeld; Zhi-Wen Sun; Hua Chung; Lei Zhu

Archive | 2004

METHOD FOR ELECTROPLATING BATH CHEMISTRY CONTROL

Aron Rosenfeld; Hooman Hafezi; Zhi-Wen Sun; Michael Yang; Joseph Behnke

Archive | 2004

Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features

Zhi-Wen Sun; Hooman Hafezi; Chunman Yu; Aron Rosenfeld; Michael Yang

Archive | 2006

Electrolytic capacitor for electric field modulation

Hooman Hafezi; Aron Rosenfeld

Archive | 2005

Immersion process for electroplating applications

Hooman Hafezi; Joseph Behnke; Aron Rosenfeld; Timothy R. Webb; Joseph Yahalom; Christopher Reiss Mcguirk

Archive | 2005

Conditioning of contact leads for metal plating systems

Hooman Hafezi; Joseph Yahalom; Roman Mostovoy; Bo Zheng; Aron Rosenfeld; You Wang; Nicolay Y. Kovarsky

Semiconductor international | 2005

Enhanced copper ECP for 45 nm devices

Hooman Hafezi; Yi-Chiau Huang; Amy Zhang; Saravjeet Singh; Chris Ngai

Archive | 2006

Grafted seed layer for electrochemical plating

Michael Yang; Aron Rosenfeld; Hooman Hafezi; Zhi-Wen Sun; John O. Dukovic

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Collaboration

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Aron Rosenfeld

Applied Materials

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Joseph Behnke

Applied Materials

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Zhi-Wen Sun

Applied Materials

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Michael Yang

Applied Materials

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Saravjeet Singh

Applied Materials

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John O. Dukovic

Applied Materials

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Joseph Yahalom

Applied Materials

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Manoocher Birang

Applied Materials

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Bo Zheng

Applied Materials

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Christopher Reiss Mcguirk

Applied Materials

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