Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Houssam Jomaa is active.

Publication


Featured researches published by Houssam Jomaa.


Archive | 2010

MULTI-CHIP PACKAGE HAVING A SUBSTRATE WITH A PLURALITY OF VERTICALLY EMBEDDED DIE AND A PROCESS OF FORMING THE SAME

Javier Soto Gonzalez; Houssam Jomaa


Archive | 2012

Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same

Houssam Jomaa; Omar J. Bchir


Archive | 2013

Substrate with embedded stacked through-silicon via die

Javier Soto Gonzalez; Houssam Jomaa


Archive | 2008

Method of enabling selective area plating on a substrate

Omar J. Bchir; Houssam Jomaa; Islam A. Salama; Yonggang Li


Archive | 2007

Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic device

Houssam Jomaa; Islam A. Salama; Yonggang Li


Archive | 2009

SELECTIVE ELECTROLESS PLATING FOR ELECTRONIC SUBSTRATES

Houssam Jomaa; Omar J. Bchir; Islam A. Salama


Archive | 2009

CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

Houssam Jomaa


Archive | 2011

Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby

Houssam Jomaa; Amruthavalli P. Alur; Dilan Seneviratne


Archive | 2011

Integrated circuit and process for fabricating thereof

Charan Gurumurthy; Islam A. Salama; Houssam Jomaa; Ravi Tanikella


Archive | 2013

MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PARTIALLY CURED EPOXY FILLERS

Ravi K. Nalla; Omar J. Bchir; Houssam Jomaa

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