Hsuan-ling Kao
Chang Gung University
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Publication
Featured researches published by Hsuan-ling Kao.
design and diagnostics of electronic circuits and systems | 2013
Hsuan-ling Kao; Chih-Sheng Yeh; Cheng-Lin Cho; Bo-Wen Wang; Ping-Che Lee; Bai-Hong Wei; Hsien-Chin Chiu
This paper presents an S-band low noise amplifier that uses a two-stage configuration. The first stage has a cascode topology and the second stage has a RC feedback topology. The S-band LNA uses a 0.35 μm AlGaN/GaN HEMT on a Si-substrate. The results show a maximum gain of 17.2 dB, a minimum noise figure of 2.9 dB and an input/output return loss greater than 9.2/10 dB. The input IIP3 at 2.8 GHz is 2.5 dBm and the unit consumes 230 mW of power.
Journal of Electronic Materials | 2018
Cheng-Lin Cho; Hsuan-ling Kao; Yung-Hsien Wu; Li-Chun Chang; Chun Hu Cheng
In this study, an inkjet-printed dielectric film that used a polymer-based SU-8 ink was fabricated for use in a metal–insulator–metal (MIM) capacitor. Thermal treatment of the inkjet-printed SU-8 polymer film affected its surface morphology, chemical structure, and surface wettability. A 20-min soft-bake at 60°C was applied to eliminate inkjet-printed bubbles and ripples. The ultraviolet-exposed SU-8 polymer film was crosslinked at temperatures between 120°C and 220°C and became disordered at 270°C, demonstrated using Fourier-transform infrared spectroscopy. A maximum SU-8 polymer film hard-bake temperature of 120°C was identified, and a printing process was subsequently employed because the appropriate water contact angle of the printed film was 79°. Under the appropriate inkjet printing conditions, the two-transmission-line method was used to extract the dielectric and electrical properties of the SU-8 polymer film, and the electrical behavior of the fabricated MIM capacitor was also characterized.
International Journal of Antennas and Propagation | 2018
Li-Chun Chang; Cheng-Lin Cho; Sameer Kamrudin Bachani; Hsuan-ling Kao
This article presents a two-layer inkjet-printed interdigital bandpass filter using lamination bonding process on liquid crystal polymer (LCP) substrates for radio frequency electronic applications. Various percentages of torque force were applied over a 4 × 4 cm2 area with a 942 kg fixed force in the lamination bonding process. The insertion loss and surface morphology of the inkjet-printed silver film were examined on various torque forces to develop the lamination bonding process. The lamination bonding was performed at 12% torque and 270°C. A three-dimensional bandpass filter was realized with a of −2.2 dB at 11.5 GHz with a 17% fractional bandwidth. A multilayer inkjet-printed bandpass filter was successfully developed to verify the design methodology and fabrication of inkjet-printing technology and lamination bonding technique for a three-dimensional integrated circuit package.
Journal of Electromagnetic Waves and Applications | 2012
Hsuan-ling Kao; C.S. Yeh; Hsien-Chin Chiu
This paper presents a novel dual-band bandpass filter with two sets of stub-loaded open-loop resonator, using stepped-impedance, which results in a reduction in size. Two sets of resonators are synthesized using a doublet coupling scheme for 60/77 GHz resonance. The two passbands are flexible due to implement with two parallel transmission paths and tuning each bandwidth independently by changing even-mode resonant frequency. The fractional 3-dB bandwidths at 60 and 77 GHz are 11.4 and 8.3%, respectively. The values at 60 and 77 GHz are −2.26 and −2.63 dB and the values at 60 and 77 GHz are −24.8 and −18.5 dB, respectively. Between the two passbands, the transmission zero at 67 GHz gives nearly 22.6 dB isolation. Good performance makes this system attractive for wireless communications.
Thin Solid Films | 2013
Hsuan-ling Kao; Cheng-Lin Cho; Li-Chun Chang; Chih-Sheng Yeh; Bo-Wen Wang; Hsien-Chin Chiu
Surface & Coatings Technology | 2017
Cheng-Lin Cho; Hsuan-ling Kao; Li-Chun Chang; Yung-Hsien Wu; Hsien-Chin Chiu
Microelectronics Reliability | 2017
Hsien-Chin Chiu; Min-Li Chou; Chun Hu Cheng; Hsuan-ling Kao; Cheng-Lin Cho
International Journal of Circuit Theory and Applications | 2017
Hsuan-ling Kao; Chih-Sheng Yeh; Hsien-Chin Chiu; Cheng-Lin Cho; Chun Hu Cheng
IEEE Transactions on Nanotechnology | 2017
Po-Chun Chen; Yu-Chien Chiu; Zhi-Wei Zheng; Ming-Huei Lin; Chun Hu Cheng; Guan-Lin Liou; H. H. Hsu; Hsuan-ling Kao
ECS Journal of Solid State Science and Technology | 2017
Yung-Yueh Chiu; P. C. Chen; Sheng-Chieh Chang; Z. W. Zheng; Chun Hu Cheng; Guan-Lin Liou; Hsuan-ling Kao; Yung-Hsien Wu; C. Y. Chang