Ian S. Latchford

Passivating, stripping and corrosion inhibition of semiconductor substrates

Photolithography scheme using a silicon containing resist

Airgap for semiconductor devices

Method for removal of photoresist over metal which also removes or inactivates corrosion-forming materials remaining from one or more previous metal etch steps

Low pressure anisotropic etch process for tantalum silicide or titanium silicide layer formed over polysilicon layer deposited on silicon oxide layer on semiconductor wafer

Process for removal of residues remaining after etching polysilicon layer in formation of integrated circuit structure

Process for etching polysilicon layer in formation of integrated circuit structure

Enhanced remote plasma cleaning

Conductive bi-layer e-beam resist with amorphous carbon

Wafer processing system and method of producing the wafer