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Featured researches published by Ichiro Tonai.


electronic components and technology conference | 1998

Low power consumption molded gigabit fiberoptic transceiver module

Hisao Go; Naoki Nishiyama; Eiji Tsumura; Yasushi Fujimura; Hiromi Nakanishi; Ichiro Tonai; Mitsuaki Nishie

The standardization task of gigabit Ethernet by IEEE802.3z working group is attracting a great deal of attention. The demands for the modules compliant with the standardized specification will be increased. We have successfully developed gigabit fiberoptic transceiver modules compliant with 1000BASE-LX, proposed specification in gigabit Ethernet. The main feature of this module is 3.3 V operation which leads to low power consumption, while most of the conventional modules operate at 5.0 V. We used the newly designed package with lower profile 9.4 mm in height. The carefully designed modules package was formed by transfer mold encapsulation techniques which contribute to the cost reduction. In this paper, the design, assembling process, and characteristics of the developed module are described.


electronic components and technology conference | 1998

Long wavelength transparent epoxy mold optical data link

Ichiro Tonai; Takashi Fukuoka; Yasuki Mikamura; Toshio Mizue; Daisuke Takagi; Takeshi Irie; Ichiro Kono

Optical data links have been spreading widely over various data communication networks. Inexpensive data links are required for further infiltration into communication networks. To meet the market demand, we developed data links with transfer molding technology in 1990 and with flexible printed circuit boards in 1995, respectively. Based on these technologies, transparent epoxy molded optical data links have been developed for further cost reduction. Optical and electrical devices are assembled on a lead frame and molded with transparent epoxy, which works as a package and a lens at the same time. The data link is designed to be used at data rates up to 155.52 Mbps or 200 Mbps.


1987 Symposium on the Technologies for Optoelectronics | 1987

The Surface Recombination Velocity And The Diffusion Length On InGaAs p-i-n Photodiodes

Ichiro Tonai; Takashi Yano; Hiroshi Okuda

Two basic parameters, the surface recombination velocity(S) and the diffusion length(Le), have been studied through investigating the responsivity of InGaAs p-i-n photodiodes without an InP window layer. The values of S and Le were found to be 10 4cm/s and 4μm, respectively. The high responsivity of 0.7A/W at λ=1.3μm was obtained without an antireflection coating due to the small surface recombination velocity.


Archive | 1995

Optical module having structure for defining fixing position of sleeve

Hiromi Kurashima; Hisato Takahashi; Ken-Ichi Kitayama; Ryoji Sakamoto; Sosaku Sawada; Takeshi Sekiguchi; Ichiro Tonai; Nobuo Shiga


Archive | 1993

Photo-sensing device

Ichiro Tonai


Archive | 1994

Connector including opposing lens surfaces, side surfaces, and contact surfaces for coupling optical devices

Osamu Akita; Ichiro Tonai


Archive | 1993

Semiconductor light detecting device making use of a photodiode chip

Yoshiki Kuhara; Hideaki Koseki; Hisato Michikoshi; Ichiro Tonai


Archive | 1994

Semiconductor element module

Ichiro Tonai; Osamu Akita


Archive | 2002

Optical connection sleeve, optical module and optical communication module

Shunsuke Sato; Toshio Mizue; Ichiro Tonai


Archive | 2002

Optical part, optical module sleeve, optical receiving module, optical communication module, and method of making optical part

Ichiro Tonai; Shunsuke Sato

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Osamu Akita

Sumitomo Electric Industries

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Toshio Mizue

Sumitomo Electric Industries

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Yoshiki Kuhara

Sumitomo Electric Industries

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Hiromi Kurashima

Sumitomo Electric Industries

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Hisato Takahashi

Sumitomo Electric Industries

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Ken-Ichi Kitayama

Sumitomo Electric Industries

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Nobuo Shiga

Sumitomo Electric Industries

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Ryoji Sakamoto

Sumitomo Electric Industries

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Shunsuke Sato

Sumitomo Electric Industries

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Sosaku Sawada

Sumitomo Electric Industries

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