Toshio Mizue

Small form factor pluggable optical transceiver module with extremely low power consumption for dense wavelength division multiplexing applications

An optical transceiver module for the dense wavelength-division-multiplexing (DWDM) applications is successfully realized with so-called small form factor pluggable (SFP) platform that is well known as the smallest platform for 2.5.Gbps optical transceiver. The power consumption of DWDM-SFP modules we developed is reduced drastically, and that is 1.0 W maximum at the operating case temperature (Tc) range of -5 to 70 degC (for typical DWDM-SFP samples). This remarkable low power consumption is achieved by next three techniques which are a compact coaxial transmitter optical sub assembly (TOSA) package with a micro thermoelectric cooler (micro-TEC), a transceiver IC chip with many functions integrated therein and an unique structure which the TOSA is isolated from other heat sources.

Long wavelength transparent epoxy mold optical data link

Optical data links have been spreading widely over various data communication networks. Inexpensive data links are required for further infiltration into communication networks. To meet the market demand, we developed data links with transfer molding technology in 1990 and with flexible printed circuit boards in 1995, respectively. Based on these technologies, transparent epoxy molded optical data links have been developed for further cost reduction. Optical and electrical devices are assembled on a lead frame and molded with transparent epoxy, which works as a package and a lens at the same time. The data link is designed to be used at data rates up to 155.52 Mbps or 200 Mbps.